M1AFS600-2FG256 vs AFS600-FGG256 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS600-2FG256 disebabkan oleh Microchip Technology dan AFS600-FGG256 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ Aktif
Pengandingan Spesifikasi
| Parametr | M1AFS600-2FG256 | AFS600-FGG256 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Unknown |
| Series | M1AFS600 (Fusion) | — |
| System Gates | 600000 gates | 600,000 gates |
| Logic Elements | 110592 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Number of I/Os | 119 I/O | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm flash-based | — |
| Kemasan / Case | 256-LBGA (FBGA-256) | — |
| Gaya Pemasangan | SMD/SMT | — |
| Operating Temperature - Minimum | 0 C | — |
| Operating Temperature - Maximum | +70 C | — |
| Packaging | Tray | — |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management (PLL) | — |
| Configuration | Flash-based, live at power-up, no external config PROM required | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum fabric operating frequency] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Cells | — | 13,824 cells |
| I/O Count | — | 119 I/Os |
| Tegangan Pemberi Arus | — | 1.5 V |
| Logic Family | — | CMOS |
| Process Technology | — | 130 nm |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Flash-based nonvolatile memory |
| Configuration Feature | — | Live at Power-Up (LAPU) |
| Frekuensi Klock Maksimum | — | 1098.9 MHz |
| Suhu Operasi | — | 0°C to 70°C |
| Package Type | — | 256-pin FBGA |
| Package Pitch | — | 1.0 mm |
| Jenis Pemasangan | — | Surface mount |
| Packing Media | — | Tray |
| RoHS | — | Compliant |