M1AFS600-2FG256 vs AFS600-FGG256 비교

다음의 상세 나란히 비교: M1AFS600-2FG256 제조: Microchip Technology 및 AFS600-FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ 활성
Microchip Technology
AFS600-FGG256 AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 Unknown

사양 비교

파라미터 M1AFS600-2FG256 AFS600-FGG256
브랜드 Microchip Technology Microchip Technology
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 Unknown
Series M1AFS600 (Fusion) —
System Gates 600000 gates 600,000 gates
Logic Elements 110592 —
Embedded Processor ARM Cortex-M1 —
Number of I/Os 119 I/O —
Core Supply Voltage 1.5 V —
Technology 130 nm flash-based —
패키지 / 케이스 256-LBGA (FBGA-256) —
장착 스타일 SMD/SMT —
Operating Temperature - Minimum 0 C —
Operating Temperature - Maximum +70 C —
Packaging Tray —
Analog Peripherals Configurable analog block (Fusion mixed-signal) —
On-chip Memory Large flash memory blocks —
Clock Management On-chip clock generation and management (PLL) —
Configuration Flash-based, live at power-up, no external config PROM required —
RoHS 상태 [DATA_NEEDED: RoHS status] —
Maximum Operating Frequency [DATA_NEEDED: maximum fabric operating frequency] —
Device Type — Fusion mixed-signal FPGA
Configurable Logic Cells — 13,824 cells
I/O Count — 119 I/Os
공급 전압 — 1.5 V
Logic Family — CMOS
Process Technology — 130 nm
Metal Layers — 7 layers
Configuration Memory — Flash-based nonvolatile memory
Configuration Feature — Live at Power-Up (LAPU)
최대 클록 주파수 — 1098.9 MHz
동작 온도 — 0°C to 70°C
Package Type — 256-pin FBGA
Package Pitch — 1.0 mm
실장 유형 — Surface mount
Packing Media — Tray
RoHS — Compliant

데이터시트 & 자료

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