M7AFS600-FGG484I vs AFS600-1FG484I Comparaison

Comparaison détaillée côte à côte de M7AFS600-FGG484I par Microchip Technology et AFS600-1FG484I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

Microchip Technology
M7AFS600-FGG484I M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip

M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip

M7AFS600-FGG484I ✓ Actif
Microchip Technology
AFS600-1FG484I AFS600-1FG484I - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-1FG484I - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-1FG484I ✓ Actif

Comparaison des spécifications

Paramètre M7AFS600-FGG484I AFS600-1FG484I
Marque Microchip Technology Microchip Technology
Catégorie FPGA & CPLD FPGA & CPLD
Statut du cycle de vie Actif Actif
Programmable Logic Family Fusion (Microsemi/Actel, now Microchip) —
System Gates 600000 gates 600,000 gates
Embedded Processor ARM CoreMP7 (ARM7TDMI-compatible) —
User I/O 172 I/O 172 I/O
Configuration Technology Flash-based, on-chip —
Core Supply Voltage 1.5 V —
Boîtier 484-BGA (FGG484), 1.0 mm ball pitch 484-BGA
Type de montage Surface Mount —
Température de fonctionnement -40C to +100C (industrial, I grade) -55°C to 100°C
Memory - Listable Resource 110592 (per DigiKey listing) —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
I/O Bank Count [DATA_NEEDED: I/O bank count] —
Embedded Flash Blocks [DATA_NEEDED: embedded flash block count] —
Analog Peripherals [DATA_NEEDED: analog peripheral configuration] —
Niveau MSL [DATA_NEEDED: moisture sensitivity level] —
Statut RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Programming Tool Chain Microchip Libero SoC (formerly Actel Libero) —
Device Type — Fusion mixed-signal FPGA
Logic Cells — 13,824 cells
Embedded Flash — 110,592 bits
Nominal Supply Voltage — 1.5 V
Supply Voltage Range — 1.425 V to 1.575 V
Process Technology — 130 nm CMOS
Metal Layers — 7 layers
Configuration Memory — Flash-based
Package Ball Count — 484 balls
Logic Family — CMOS
Clock Generation — Comprehensive clock generation and management circuitry
Mixed-Signal Features — Configurable analog resources
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

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