M7AFS600-FGG484I vs AFS600-1FG484I Сравнение
Подробное сравнение бок о бок M7AFS600-FGG484I от Microchip Technology и AFS600-1FG484I от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip
M7AFS600-FGG484I ✓ АктивенMicrochip Technology
AFS600-1FG484I - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-1FG484I ✓ АктивенСравнение характеристик
| Параметр | M7AFS600-FGG484I | AFS600-1FG484I |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Programmable Logic Family | Fusion (Microsemi/Actel, now Microchip) | — |
| System Gates | 600000 gates | 600,000 gates |
| Embedded Processor | ARM CoreMP7 (ARM7TDMI-compatible) | — |
| User I/O | 172 I/O | 172 I/O |
| Configuration Technology | Flash-based, on-chip | — |
| Core Supply Voltage | 1.5 V | — |
| Корпус | 484-BGA (FGG484), 1.0 mm ball pitch | 484-BGA |
| Тип монтажа | Surface Mount | — |
| Рабочая температура | -40C to +100C (industrial, I grade) | -55°C to 100°C |
| Memory - Listable Resource | 110592 (per DigiKey listing) | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| I/O Bank Count | [DATA_NEEDED: I/O bank count] | — |
| Embedded Flash Blocks | [DATA_NEEDED: embedded flash block count] | — |
| Analog Peripherals | [DATA_NEEDED: analog peripheral configuration] | — |
| Уровень MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Programming Tool Chain | Microchip Libero SoC (formerly Actel Libero) | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Logic Cells | — | 13,824 cells |
| Embedded Flash | — | 110,592 bits |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Flash-based |
| Package Ball Count | — | 484 balls |
| Logic Family | — | CMOS |
| Clock Generation | — | Comprehensive clock generation and management circuitry |
| Mixed-Signal Features | — | Configurable analog resources |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |