MC7447AVS1000LB - 1GHz PowerPC G4 MPU, 360-FCCLGA | NXP
Référence : MC7447AVS1000LB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $195 | $195,00 |
| 10 | $175.5 | $1 755,00 |
| 100 | $156 | $15 600,00 |
| 500 | $137.5 | $68 750,00 |
| 1 000 | $121 | $121 000,00 |
MC7447AVS1000LB Présentation
Background: A microprocessor unit (MPU) is the central processing unit of an embedded computing system, integrating one or more processor cores with on-chip cache memory and a system interface. The PowerPC G4 family (MPC74xx) is a superset of the PowerPC architecture with AltiVec/VMX single-instruction multiple-data (SIMD) extensions optimised for high-throughput signal processing, image processing, and embedded compute workloads. MCUs/MPUs sit at the top of the semiconductor hierarchy: MPU -> microprocessor -> processor -> SoC -> integrated circuit -> semiconductor, distinguishing them from microcontrollers (MCUs) which integrate flash and peripherals on-die.
Key features include a 200 MHz MPX system bus interface, dual 1.8 V and 2.5 V supply rails, integrated thermal management logic with on-die temperature sensors, and support for SMP-coherent multiprocessor configurations through the MPX bus. The 130 nm CMOS process with copper interconnect provides a balance of performance and thermal envelope for embedded use.
Technical depth: The G4 core employs a 7-stage integer pipeline with out-of-order execution, a 128-bit AltiVec/VMX vector unit executing up to 16 single-precision operations per cycle, and a unified 512 KB on-chip L2 cache shared between instruction and data streams. The on-chip MPX bus delivers up to 3.2 GB/s peak bandwidth and supports cache-coherent SMP configurations of two MC7447A devices.
Typical applications include aerospace/defense single-board computers, industrial control systems, network-attached storage controllers, medical imaging equipment, and high-performance embedded controllers. The wide 1.8 V/2.5 V tolerance and on-chip thermal management make the part attractive for harsh-environment designs.
When designing with this part, observe the junction temperature limit of 105 °C and ensure the FCCLGA socket or land-pattern thermal management is adequate for the 20 W typical power envelope. Obsolescence planning is essential: the MPC74xx family has been NRND/EOL for several years; long-term designs should consider the e600 (MPC86xx) or QorIQ families for new deployments.
This page synthesizes distributor pricing, drop-in alternative MPC74xx MPNs, and design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MC7447AVS1000LB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC7447AVS1000LB (même facteur de forme et même empreinte) — différant par Maximum Clock Frequency, Process Technology, Package, Core Architecture, L1 Instruction Cache.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC7447AHX1000LB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7447AVS1000NB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7448VS1000LB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7447AVS1167NB
✅ Remplacement direct✓ En stock
$189.5 / unité
Voir la fiche technique →MPC7410VS500LE
✅ Remplacement direct✓ En stock
$162 / unité
Voir la fiche technique →MC7447AVS1000LB Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC G4 (MPC74xx) with AltiVec/VMX SIMD |
| Number of Cores | 1 |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 1.0 GHz |
| L1 Instruction Cache | 64 KB |
| L1 Data Cache | 32 KB |
| L2 Cache (on-chip) | 512 KB unified |
| System Bus / MPX Bus | 200 MHz, up to 3.2 GB/s |
| Supply Voltage (Core) | 1.8 V |
| Supply Voltage (I/O) | 2.5 V |
| Process Technology | 130 nm CMOS with copper interconnect |
| Boîtier | 360-FCCLGA (25 x 25 mm) |
| Junction Temperature (Tj max) | 105 °C |
| Typical Power Dissipation | approximately 20 W at 1.0 GHz (Estimated: based on typical MPC74xx @ 1 GHz core voltage) |
Guide de configuration des broches du MC7447AVS1000LB 360-fcclga (25 x 25 mm)
Configuration des broches du MC7447AVS1000LB (boîtier 360-fcclga (25 x 25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC7447AVS1000LB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC7447AVS1000LB convient pour 6 applications: Aerospace and Defense Single-Board Computers, Network-Attached Storage Controllers, Industrial Process Control and Automation, Medical Imaging and Diagnostic Equipment, High-Performance Embedded Printers and Imaging, Telecom Base-Station Controllers.
Aerospace and Defense Single-Board Computers
The MC7447AVS1000LB's 1.0 GHz PowerPC G4 core with AltiVec/VMX SIMD makes it suitable for aerospace/defense single-board computer (SBC) applications where deterministic compute and AltiVec vector processing accelerate radar front-end preprocessing, image exploitation, and signal-intelligence pipelines. The 360-FCCLGA ceramic land-grid array supports hermetic and ruggedised enclosures required in avionics, while 1.8 V core and 2.5 V I/O rails integrate cleanly with legacy PowerPC backplanes. The MPX bus sustains 3.2 GB/s peak bandwidth to companion memory and I/O bridges, which is critical for radar and SIGINT throughput. Verified longevity remains a concern; systems already fielded may keep using the part under life-of-program support, but new programs should target QorIQ P3041 or T1042.
Recommandé
Network-Attached Storage Controllers
In NAS controllers and storage-area network (SAN) head nodes, the MC7447AVS1000LB provides the compute headroom required for software RAID (RAID-5/6 parity computation), iSCSI/NFS protocol processing, and on-disk encryption acceleration. The 1.0 GHz core combined with AltiVec delivers single-precision throughput adequate for 1 GbE-class storage front-ends. The 200 MHz MPX bus enables high-bandwidth DMA transfers to companion PCI-X bridges that connect to SAS/SATA controllers. The 130 nm process provides predictable thermal behaviour under sustained RAID rebuild workloads, while the 360-FCCLGA package dissipates heat through the host board's thermal management surface.
Recommandé
Industrial Process Control and Automation
Industrial PLCs, motion controllers, and SCADA edge nodes benefit from the MC7447AVS1000LB's deterministic PowerPC architecture and AltiVec-accelerated DSP routines for real-time control loops. The 1.0 GHz throughput supports multi-axis motion planning and PID updates at millisecond cadence. The 360-FCCLGA ceramic package tolerates industrial thermal envelopes, and the 1.8 V/2.5 V split supply matches conventional power-rail design. Pair the MPU with an MPX-to-PCI-X bridge and dedicated FPGA I/O for deterministic machine control. Long-term availability is constrained - fielded industrial systems may continue using the part with life-cycle support contracts.
Recommandé
Medical Imaging and Diagnostic Equipment
Medical imaging modalities such as ultrasound front-end processing, CT image reconstruction pre-processing, and digital X-ray pipelines can leverage the MC7447AVS1000LB's AltiVec/VMX unit for SIMD-parallel pixel transforms. The 1.0 GHz core performs beamforming and FIR filtering on raw transducer data; the 512 KB on-chip L2 cache keeps pixel arrays close to the core. The 32-bit data path suits legacy medical-software stacks and the 360-FCCLGA package allows integration into imaging carts with adequate thermal dissipation. Designers should validate IEC 60601-1 compliance and consider AEC-Q100-qualified successors for new platforms.
Recommandé
High-Performance Embedded Printers and Imaging
Production-class printers, multi-function imaging devices, and large-format plotters integrate the MC7447AVS1000LB to drive RIP (raster image processor) pipelines at 1 GHz, with AltiVec accelerating halftoning, JPEG/PNG decode, and colour-space conversion. The 32-bit PowerPC architecture supports legacy PostScript and PCL firmware stacks, while the 200 MHz MPX bus sustains high-throughput DMA to scanner/print-engine subsystems. The 360-FCCLGA package is well-suited to enclosed printer controllers with conductive cooling; the 1.8 V/2.5 V split rail simplifies integration with mixed-voltage peripherals.
Recommandé
Telecom Base-Station Controllers
Legacy 3G/4G base-station controllers and edge routers can host the MC7447AVS1000LB for layer-2/3 packet processing, encryption offload, and DSP-assisted voice codecs. The 1.0 GHz core and AltiVec SIMD accelerate bulk cryptographic operations (AES, SHA) and packet-header classification. The 200 MHz MPX bus maintains 3.2 GB/s peak interconnect bandwidth to multi-Gigabit Ethernet MACs. The ceramic FCCLGA package supports extended-temperature telecom enclosures; the 1.8 V/2.5 V supply rails are compatible with conventional telecom power architectures. New 5G deployments should evaluate QorIQ or Layerscape families.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC7447AVS1000LB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC7447AHX1000LB | MC7447AVS1000NB | MC7448VS1000LB | MC7447AVS1167NB | MPC7410VS500LE |
|---|---|---|---|---|---|---|
| Package | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) - same | 360-FCCLGA (25x25 mm) - same | 360-FCCLGA (25x25 mm) - same | 360-FCCLGA (25x25 mm) - same | 360-FCCBGA - functionally same footprint |
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | Freescale Semiconductor / NXP | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.167 GHz | 500 MHz |
| Core Architecture | PowerPC G4 with AltiVec/VMX | PowerPC G4 with AltiVec/VMX | PowerPC G4 with AltiVec/VMX | PowerPC G4 with enhanced L2 | PowerPC G4 with AltiVec/VMX | PowerPC G4 (no AltiVec/VMX) |
| L2 Cache (on-chip) | 512 KB unified | 512 KB unified | 512 KB unified | 1 MB unified (MPC7448) | 512 KB unified | 256 KB unified |
| MPX System Bus Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 100 MHz |
| Core Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.0 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| AltiVec/VMX Support | Yes | Yes | Yes | Yes | Yes | No |
Principaux différenciateurs
- Lead-free ball finish variant (vs MC7447AVS1000NB)
- AltiVec/VMX SIMD unit included (vs MPC7410VS500LE)
- 512 KB unified on-chip L2 cache (vs MPC7410VS500LE)
Notes de conception
The MC7447AVS1000LB dissipates approximately 20 W at 1.0 GHz core clock (Estimated: based on typical MPC7447A datasheet figures for 1.8 V core). The FCCLGA package requires a heatsink or thermal interface material bonded to a copper spreader; without active cooling the junction temperature can exceed 105 °C Tj max in enclosed chassis. Validate thermal design against worst-case ambient (typically 55 °C in industrial and 70 °C in aerospace convection-cooled enclosures).
Provide separate 1.8 V core and 2.5 V I/O rails; sequence core before I/O to prevent latch-up. Bulk decoupling should sit within 25 mm of the FCCLGA socket with high-frequency ceramic capacitors distributed around the land-grid array periphery. The MPX bus drivers draw dynamic current proportional to bus activity, so 2.5 V rail decoupling must sustain transient peaks without droop.
The 360-FCCLGA land pattern requires precision PCB fabrication - via-in-pad with tented or filled-and-plated-over vias is recommended. Match the land-grid pitch (1.27 mm typical for FCCLGA) per the NXP mechanical drawing. Controlled-impedance routing for the MPX bus is critical; route the bus on an inner layer with reference ground plane on both sides. Length-match within +/- 5 ps across the bus to avoid setup/hold violations.
Do not substitute the MC7447AVS1000LB with a higher-clocked MPC7447A variant without verifying host firmware sets the correct bus-to-core multiplier at power-on reset - otherwise the system will fail to boot. Confirm the FCCLGA socket tooling is rated for the chosen ball-finish (LB lead-free vs NB variant). Refer to Freescale/NXP application note AN2181 (PowerPC G4 thermal management) for heatsink selection guidance.
Informations de conformité
LB suffix designates lead-free ball finish per Freescale/NXP ordering information. RoHS, REACH, halogen-free, and conflict-minerals statements should be confirmed with NXP product compliance documentation; AEC-Q100 is not applicable because this is a microprocessor rather than an automotive-grade IC.
