MC9S08AC16CFDE vs MC9S08AC32CFDE Comparaison
Comparaison détaillée côte à côte de MC9S08AC16CFDE par NXP Semiconductors et MC9S08AC32CFDE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP
MC9S08AC16CFDE ✗ Fin de vieNXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndComparaison des spécifications
| Paramètre | MC9S08AC16CFDE | MC9S08AC32CFDE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2,05 | $3,02 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Fréquence d'horloge maximale | 40 MHz | — |
| Flash Memory | 16 KB (16K x 8) | — |
| RAM Size | 4 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 38 | — |
| Program Memory Type | Flash | — |
| Package Type | 48-QFN-EP (7x7 mm), HVQCCN | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Peripherals | [DATA_NEEDED: peripheral list (timers, SCI/SPI)] | — |
| Series | S08AC (Flexis series) | — |
| Life Cycle Stage | End of Life (per NXP product page) | — |
| Statut RoHS | RoHS Compliant | — |
| Package Pin Count | 48 | — |
| Packaging | Tray | — |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Plage de température de fonctionnement | — | -40 C to +125 C (automotive grade) |
| Number of I/O Pins | — | 38 |
| Boîtier | — | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| ADC | — | 8-channel, 10-bit |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Communication Interfaces | — | SCI (UART) and SPI |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Largeur du bus de données | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |
| Statut du cycle de vie | — | NRND (Not Recommended for New Designs, per NXP product page) |