MC9S08AC16CFDE vs MC9S08AC32CFDE Comparação
Comparação detalhada lado a lado de MC9S08AC16CFDE por NXP Semiconductors e MC9S08AC32CFDE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP
MC9S08AC16CFDE ✗ Fim de vidaNXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndComparação de especificações
| Parâmetro | MC9S08AC16CFDE | MC9S08AC32CFDE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Fim de vida | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $2,05 | $3,02 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Frequência máxima de clock | 40 MHz | — |
| Flash Memory | 16 KB (16K x 8) | — |
| RAM Size | 4 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 38 | — |
| Program Memory Type | Flash | — |
| Package Type | 48-QFN-EP (7x7 mm), HVQCCN | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Peripherals | [DATA_NEEDED: peripheral list (timers, SCI/SPI)] | — |
| Series | S08AC (Flexis series) | — |
| Life Cycle Stage | End of Life (per NXP product page) | — |
| Status RoHS | RoHS Compliant | — |
| Package Pin Count | 48 | — |
| Packaging | Tray | — |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Faixa de temperatura de operação | — | -40 C to +125 C (automotive grade) |
| Number of I/O Pins | — | 38 |
| Encapsulamento | — | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| ADC | — | 8-channel, 10-bit |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Communication Interfaces | — | SCI (UART) and SPI |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Largura do barramento de dados | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |
| Status do ciclo de vida | — | NRND (Not Recommended for New Designs, per NXP product page) |