MC9S08AC16CFDE vs MC9S08AC32CFDE Vergleich

Detaillierter Direktvergleich von MC9S08AC16CFDE von NXP Semiconductors und MC9S08AC32CFDE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08AC16CFDE MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP

MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP

MC9S08AC16CFDE ✗ Abgekündigt

Spezifikationsvergleich

Parameter MC9S08AC16CFDE MC9S08AC32CFDE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Ende des Lebenszyklus NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $2,05 $3,02
Core Processor S08 (HCS08) 8-bit CISC —
Core Size 8-Bit —
Maximale Taktfrequenz 40 MHz —
Flash Memory 16 KB (16K x 8) —
RAM Size 4 KB —
Supply Voltage Range 2.7 V to 5.5 V —
Number of I/O 38 —
Program Memory Type Flash —
Package Type 48-QFN-EP (7x7 mm), HVQCCN —
Montageart Surface Mount Surface Mount
Betriebstemperatur [DATA_NEEDED: operating temperature range] —
ADC Resolution [DATA_NEEDED: ADC resolution and channels] —
Peripherals [DATA_NEEDED: peripheral list (timers, SCI/SPI)] —
Series S08AC (Flexis series) —
Life Cycle Stage End of Life (per NXP product page) —
RoHS-Status RoHS Compliant —
Package Pin Count 48 —
Packaging Tray —
Core Architecture — S08 (HCS08 family, 8-bit CISC)
Program Memory (Flash) — 32 KB
RAM — 1 KB
Maximum CPU Frequency — 40 MHz
Supply Voltage (VDD) — 2.7 V to 5.5 V
Betriebstemperaturbereich — -40 C to +125 C (automotive grade)
Number of I/O Pins — 38
Gehäuse — 48-QFN-EP (7x7 mm) with exposed thermal pad
ADC — 8-channel, 10-bit
Timers — 16-bit timer/PWM, plus additional 8-bit and 2-channel modules
Communication Interfaces — SCI (UART) and SPI
Debug Interface — Single-wire BDM (Background Debug Mode)
Internal Clock Source — Yes (ICS - Internal Clock Source)
Temperature Grade — Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter]
Datenbusbreite — 8-bit
MSL (Moisture Sensitivity Level) — MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life]
RoHS Compliance — Compliant (per NXP product page)
Lead-Free — Yes (per distributor packaging datasheet)
Lebenszyklusstatus — NRND (Not Recommended for New Designs, per NXP product page)

Datenblätter & Ressourcen

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