MC9S08AW60MFDE - 8-bit HCS08 MCU 60KB Flash 40MHz | NXP
Référence : MC9S08AW60MFDE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.17 | $7,17 |
| 10 | $6.45 | $64,50 |
| 100 | $5.73 | $573,00 |
| 500 | $5.02 | $2 510,00 |
| 1 000 | $4.46 | $4 460,00 |
MC9S08AW60MFDE Présentation
An MCU (microcontroller unit) is a single-chip computer that combines a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of on-chip peripherals such as timers, ADC, communication controllers, and GPIO. Within the semiconductor taxonomy the MC9S08AW60MFDE belongs to the HCS08 8-bit microcontroller family, sitting under the broader category of embedded microcontrollers, which in turn belong to microprocessors and digital logic ICs. The HCS08 family is an enhanced evolution of the legacy HC08 core, adding the BGND instruction for background debug, improved instruction throughput, and lower active/idle current draws.
Key features include 60 KB of embedded Flash with in-application programmability, an internal clock generator with options for an external crystal or resonator, multiple 16-bit timer/PWM channels, up to 16 channels of 10-bit ADC, SCI (UART), SPI, and I2C peripherals, plus a real-time counter and a watchdog timer for safety-critical control loops. The device supports both industrial and automotive-grade application profiles per its family datasheet.
The HCS08 core uses a von Neumann architecture with a 16-bit stack pointer, 16-bit index register (H:X), and a compact CISC instruction set that is largely source-compatible with HC08 assembly while delivering roughly 50% better performance per clock cycle. The integrated voltage regulator and brown-out reset block simplify 3.3 V and 5 V single-rail designs, while the BDM single-wire debug interface eliminates the need for an expensive in-circuit emulator during prototype development.
Typical applications include industrial sensor conditioning, white-goods motor control, automotive body controllers, HVAC blower/fan controllers, low-end graphical display panels, and small-form-factor consumer appliances. The wide 2.7 V to 5.5 V input range makes it compatible with both 3.3 V and 5 V sensor and actuator systems.
When designing with this part, pay close attention to decoupling: place a 100 nF X7R bypass capacitor within 1-2 mm of each power pin and a bulk 4.7 uF to 10 uF tantalum or ceramic capacitor near the package exposed pad. Also ensure the BDM pin is routed to a header or test pad for in-system debug, and verify that the IRQ pin has a proper pull-up if unused.
This page synthesizes distributor pricing, drop-in alternatives from the same AW60/AW48/AW32/AW16 family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC9S08AW60MFDE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08AW60MFDE (même facteur de forme et même empreinte) — différant par Package, RoHS Status, ADC, Communication Interfaces, Debug Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08AW48CFDE
✅ Remplacement direct✓ En stock
$5.02 / unité
Voir la fiche technique →MC9S08AW48MFDE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08AW32MFDE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08AW16MFDE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08AC60CFDE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.6 / unité
Voir la fiche technique →MC9S08AW60MFDE Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS08 (8-bit CISC, enhanced HC08) |
| CPU Speed | 40 MHz (20 MHz internal bus) |
| Program Memory | 60 KB Flash |
| RAM | 2 KB |
| Tension d'alimentation | 2.7 V to 5.5 V |
| I/O Ports | 38 |
| Boîtier | 48-pin QFN-EP (7x7 mm, MO-220VKKD-2, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (industrial) |
| ROM Type | Flash (in-application programmable) |
| Debug Interface | Single-wire BDM (background debug mode) |
| ADC | Up to 16-channel 10-bit |
| Timers | Multiple 16-bit timer/PWM channels |
| Communication | SCI (UART), SPI, I2C |
| Statut RoHS | Compliant |
Configuration des broches de MC9S08AW60MFDE
| Broche 1 | PTD0/TxD1 — GPIO / SCI1 transmit |
| Broche 2 | PTD1/RxD1 — GPIO / SCI1 receive |
| Broche 3 | PTD2 — GPIO |
| Broche 4 | PTD3 — GPIO |
| Broche 5 | VSS — Ground |
| Broche 6 | VDD — Supply voltage (2.7-5.5 V) |
| Broche 7 | PTA0 — GPIO / ADC channel |
| Broche 8 | PTA1 — GPIO / ADC channel |
| Broche 9 | PTA2 — GPIO / ADC channel |
| Broche 10 | PTA3 — GPIO / ADC channel |
| Broche 11 | PTA4 — GPIO |
| Broche 12 | PTA5/IRQ — GPIO / external interrupt |
| Broche 13 | PTA6 — GPIO |
| Broche 14 | PTA7 — GPIO |
| Broche 15 | PTB0 — GPIO / ADC channel |
| Broche 16 | PTB1 — GPIO / ADC channel |
| Broche 17 | PTB2 — GPIO / ADC channel |
| Broche 18 | PTB3 — GPIO / ADC channel |
| Broche 19 | PTB4 — GPIO |
| Broche 20 | PTB5 — GPIO |
| Broche 21 | PTB6 — GPIO |
| Broche 22 | PTB7 — GPIO |
| Broche 23 | PTC0 — GPIO / timer channel |
| Broche 24 | PTC1 — GPIO / timer channel |
| Broche 25 | PTC2 — GPIO / timer channel |
| Broche 26 | PTC3 — GPIO / timer channel |
| Broche 27 | PTC4 — GPIO / SPI signal |
| Broche 28 | PTC5 — GPIO / SPI signal |
| Broche 29 | PTC6 — GPIO / SPI signal |
| Broche 30 | PTC7 — GPIO / SPI signal |
| Broche 31 | PTD4 — GPIO |
| Broche 32 | PTD5 — GPIO |
| Broche 33 | PTD6 — GPIO |
| Broche 34 | PTD7 — GPIO |
| Broche 35 | PTE0 — GPIO / I2C SDA |
| Broche 36 | PTE1 — GPIO / I2C SCL |
| Broche 37 | PTE2 — GPIO |
| Broche 38 | PTE3 — GPIO |
| Broche 39 | PTE4 — GPIO |
| Broche 40 | PTE5 — GPIO |
| Broche 41 | PTE6 — GPIO |
| Broche 42 | PTE7 — GPIO |
| Broche 43 | BKGD/MS — Background debug mode / mode select |
| Broche 44 | RESET — Reset input (active low) |
| Broche 45 | EXTAL — External clock/crystal input |
| Broche 46 | XTAL — External clock/crystal output |
| Broche 47 | VSS — Ground |
| Broche 48 | VDD — Supply voltage (2.7-5.5 V) |
Applications typiques
MC9S08AW60MFDE convient pour 6 applications: Industrial Sensor Conditioning, White-Goods Motor Control, Automotive Body Controller, HVAC Blower and Fan Controller, Low-End Graphical Display Panel, Small Consumer Appliance Controller.
Industrial Sensor Conditioning
The MC9S08AW60MFDE fits industrial sensor conditioning because its 16-channel 10-bit ADC and 38 GPIO can interface directly with multi-sensor arrays while the 40 MHz HCS08 core provides ample cycles for filtering and linearization. Placed on a 3.3 V or 5 V sensor board, the MCU reads thermocouples, strain gauges, and pressure transducers via the ADC, then transmits processed values over SCI/SPI to a host PLC. The 60 KB Flash accommodates calibration tables for multi-point compensation, and the single-wire BDM allows in-line factory calibration during production.
Recommandé
White-Goods Motor Control
The MC9S08AW60MFDE drives washing-machine, dishwasher, and refrigerator motors because its 16-bit timer/PWM channels deliver precise duty-cycle control for brushless DC and universal-motor commutation. With 60 KB Flash, the firmware can hold advanced trapezoidal or sinusoidal commutation algorithms and the 2.7 V to 5.5 V supply range accepts rectified mains directly. The 38 GPIO supports Hall-sensor inputs, fault indicators, and triac gating, while integrated watchdog and brown-out reset improve field reliability.
Recommandé
Automotive Body Controller
The MC9S08AW60MFDE serves automotive body controllers (door modules, seat controllers, mirror adjusters) where moderate Flash and LIN-compatible SCI peripherals handle switch scanning, LED driving, and motor pulse-width control. The 48-pin QFN-EP (7x7) package fits the small PCB footprint typical of door-modules, and the -40C to +85C industrial temperature rating covers most cabin environments. The HCS08 BGND instruction and single-wire BDM enable efficient end-of-line programming in the factory.
Recommandé
HVAC Blower and Fan Controller
The MC9S08AW60MFDE controls HVAC blower speeds and exhaust fans via closed-loop PWM where the 40 MHz core samples tachometer feedback and adjusts duty cycle within tight tolerance. Its 16-bit timers generate center-aligned PWM for low-acoustic-noise motor drive, and the 10-bit ADC monitors current sense for stall detection. The wide 2.7 V to 5.5 V supply accepts 5 V from rectified mains, while the integrated brown-out reset protects against brown-line voltage dips during motor inrush.
Recommandé
Low-End Graphical Display Panel
The MC9S08AW60MFDE drives low-end graphical LCD or segment displays in appliances and instruments where the 60 KB Flash stores fonts, bitmaps, and menu trees while the SPI peripheral streams pixel data to the display controller. Its 38 GPIO provides direct connections to segment signals, keypads, and backlight PWM. The single-wire BDM lets production engineers update graphics firmware without disassembling the product, and the low active current draw supports battery-backed display modules.
Recommandé
Small Consumer Appliance Controller
The MC9S08AW60MFDE embeds into small consumer appliances such as coffee makers, toasters, and rice cookers where the HCS08 core manages temperature profiling, timing sequences, and user-interface button scanning. The 60 KB Flash accommodates multi-language UI strings and recipe presets, and the integrated 16-bit timers drive Triac-phase-control heating elements safely. The exposed-pad QFN-EP package handles thermal dissipation when paired with heating MOSFETs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08AW60MFDE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08AW48CFDE | MC9S08AW48MFDE | MC9S08AW32MFDE | MC9S08AW16MFDE | MC9S08AC60CFDE |
|---|---|---|---|---|---|---|
| Package | 48-pin QFN-EP (7x7) | 48-pin QFN-EP (7x7) - same | 48-pin QFN-EP (7x7) - same | 48-pin QFN-EP (7x7) - same | 48-pin QFN-EP (7x7) - same | 48-pin QFN-EP (7x7) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 60 KB | 48 KB | 48 KB | 32 KB | 16 KB | 60 KB |
| CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB | 2 KB |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| GPIO Count | 38 | 38 | 38 | 38 | 38 | 38 |
| Core Family | HCS08 (AW family) | HCS08 (AW family) | HCS08 (AW family) | HCS08 (AW family) | HCS08 (AW family) | HCS08 (AC family) |
Principaux différenciateurs
- Highest Flash density in the AW60 family (vs MC9S08AW48CFDE)
- Pin-compatible LQFP alternative available (vs MC9S08AW60MFGE)
- Industrial + automotive dual profile support (vs MC9S08AW32MFDE)
Notes de conception
Place a 100 nF X7R 0603 ceramic bypass capacitor within 1-2 mm of each VDD pin (pins 6 and 48) and a bulk 4.7 uF to 10 uF tantalum or ceramic capacitor near the package exposed pad. The exposed pad (EP) must be soldered to a continuous ground plane for both thermal dissipation and electrical reference; otherwise the internal voltage regulator may oscillate and the ADC readings can drift. Decouple VREF separately if using the ADC reference feature.
Route the BKGD/MS pin to a 2x5 or 1x6 header for in-system debug. Place the header at the board edge for easy probe access during factory programming. Keep the RESET line short and add a 10 kohm pull-up to VDD plus a 100 nF capacitor to ground for noise immunity, per NXP hardware design guides for the HCS08 family. Route the XTAL/EXTAL traces symmetrically with a grounded guard ring to reduce EMI pickup.
Do not exceed 5.5 V on VDD or apply voltage to any pin before VDD ramps up; the HCS08 family lacks comprehensive parasitic-power robustness. Ensure the IRQ pin has a proper pull-up if unused (it is edge-sensitive by default). When migrating from the LQFP-48 (MFGE suffix) to this QFN-EP (MFDE suffix), the PCB land pattern is NOT drop-in compatible - the QFN-EP requires a center thermal pad and shorter lead lengths.
Informations de conformité
RoHS compliant per NXP product page. Not AEC-Q100 qualified in the MFDE industrial-temperature variant; review NXP documentation for AEC-Q100 automotive variants within the AW60 family.
