MC9S08DV60AMLH vs MC9S08DV48ACLC Comparaison
Comparaison détaillée côte à côte de MC9S08DV60AMLH par NXP Semiconductors et MC9S08DV48ACLC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08DV60AMLH | MC9S08DV48ACLC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3,85 | $4,85 |
| Core Processor | S08 (HCS08), 8-bit | — |
| Core Size | 8-Bit | — |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | — |
| Number of I/O | 53 | — |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Tension d'alimentation | 3.3V/5V | 3.3 V / 5 V |
| Boîtier / Format | 64-LQFP (10x10 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Core | — | S08 (HCS08) 8-bit CISC |
| CPU | — | 40 MHz HCS08 core, 20 MHz bus |
| Program Memory (Flash) | — | 48 KB (48K x 8) |
| RAM | — | 2 KB (2K x 8) |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| I/O Pins | — | 25 |
| ADC | — | 16-channel, 12-bit, 2.5 us conversion |
| CAN | — | 1 x CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Timers | — | TPM, RTI, PIT |
| Température de fonctionnement | — | -40 C to +85 C (industrial) |
| Boîtier | — | 32-LQFP (7 x 7 mm) |
| Interrupt Sources | — | Up to 32 |
| Debug Interface | — | Background Debug Mode (BDM), single-wire |