MC9S08DV60AMLH vs MC9S08DV48ACLC Vergleich
Detaillierter Direktvergleich von MC9S08DV60AMLH von NXP Semiconductors und MC9S08DV48ACLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DV60AMLH | MC9S08DV48ACLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,85 | $4,85 |
| Core Processor | S08 (HCS08), 8-bit | — |
| Core Size | 8-Bit | — |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | — |
| Number of I/O | 53 | — |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Versorgungsspannung | 3.3V/5V | 3.3 V / 5 V |
| Gehäuse / Bauform | 64-LQFP (10x10 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Core | — | S08 (HCS08) 8-bit CISC |
| CPU | — | 40 MHz HCS08 core, 20 MHz bus |
| Program Memory (Flash) | — | 48 KB (48K x 8) |
| RAM | — | 2 KB (2K x 8) |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| I/O Pins | — | 25 |
| ADC | — | 16-channel, 12-bit, 2.5 us conversion |
| CAN | — | 1 x CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Timers | — | TPM, RTI, PIT |
| Betriebstemperatur | — | -40 C to +85 C (industrial) |
| Gehäuse | — | 32-LQFP (7 x 7 mm) |
| Interrupt Sources | — | Up to 32 |
| Debug Interface | — | Background Debug Mode (BDM), single-wire |