MC9S08DV60AMLH vs MC9S08DV48ACLC Comparação
Comparação detalhada lado a lado de MC9S08DV60AMLH por NXP Semiconductors e MC9S08DV48ACLC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08DV60AMLH | MC9S08DV48ACLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $3,85 | $4,85 |
| Core Processor | S08 (HCS08), 8-bit | — |
| Core Size | 8-Bit | — |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | — |
| Number of I/O | 53 | — |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Tensão de alimentação | 3.3V/5V | 3.3 V / 5 V |
| Encapsulamento / Caixa | 64-LQFP (10x10 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Core | — | S08 (HCS08) 8-bit CISC |
| CPU | — | 40 MHz HCS08 core, 20 MHz bus |
| Program Memory (Flash) | — | 48 KB (48K x 8) |
| RAM | — | 2 KB (2K x 8) |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| I/O Pins | — | 25 |
| ADC | — | 16-channel, 12-bit, 2.5 us conversion |
| CAN | — | 1 x CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Timers | — | TPM, RTI, PIT |
| Temperatura de operação | — | -40 C to +85 C (industrial) |
| Encapsulamento | — | 32-LQFP (7 x 7 mm) |
| Interrupt Sources | — | Up to 32 |
| Debug Interface | — | Background Debug Mode (BDM), single-wire |