MC9S08DV60AMLH vs MC9S08DV60AMLC Comparaison
Comparaison détaillée côte à côte de MC9S08DV60AMLH par NXP Semiconductors et MC9S08DV60AMLC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08DV60AMLH | MC9S08DV60AMLC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3,85 | $2,45 |
| Core Processor | S08 (HCS08), 8-bit | S08 (HCS08) |
| Core Size | 8-Bit | 8-Bit |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | 3 KB |
| Number of I/O | 53 | [DATA_NEEDED: GPIO count] |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | — |
| Interrupt/Reset Sources | Up to 32 | Up to 32 |
| Tension d'alimentation | 3.3V/5V | [DATA_NEEDED: supply voltage range] |
| Boîtier / Format | 64-LQFP (10x10 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Flash Memory | — | 60 KB (60K x 8) |
| Boîtier | — | 32-LQFP (7 x 7 mm) |
| On-Chip Debug | — | Background Debug Mode (BDM) emulation/debug |
| Communication Interface | — | Embedded CAN |
| Target Markets | — | Automotive and industrial |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Statut RoHS | — | [DATA_NEEDED: RoHS status] |
| Statut du cycle de vie | — | NRND (Not Recommended for New Designs) |