MC9S08DV60AMLH vs MC9S08DV60AMLC Comparação
Comparação detalhada lado a lado de MC9S08DV60AMLH por NXP Semiconductors e MC9S08DV60AMLC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08DV60AMLH | MC9S08DV60AMLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $3,85 | $2,45 |
| Core Processor | S08 (HCS08), 8-bit | S08 (HCS08) |
| Core Size | 8-Bit | 8-Bit |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | 3 KB |
| Number of I/O | 53 | [DATA_NEEDED: GPIO count] |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | — |
| Interrupt/Reset Sources | Up to 32 | Up to 32 |
| Tensão de alimentação | 3.3V/5V | [DATA_NEEDED: supply voltage range] |
| Encapsulamento / Caixa | 64-LQFP (10x10 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Flash Memory | — | 60 KB (60K x 8) |
| Encapsulamento | — | 32-LQFP (7 x 7 mm) |
| On-Chip Debug | — | Background Debug Mode (BDM) emulation/debug |
| Communication Interface | — | Embedded CAN |
| Target Markets | — | Automotive and industrial |
| Temperatura de operação | — | [DATA_NEEDED: operating temperature range] |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Status do ciclo de vida | — | NRND (Not Recommended for New Designs) |