S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP
Référence : S9S08DZ60F1MLF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $7.2 | $72,00 |
| 100 | $6.4 | $640,00 |
| 500 | $5.55 | $2 775,00 |
| 1 000 | $4.95 | $4 950,00 |
S9S08DZ60F1MLF Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripheral interfaces, and clock generation into one package, enabling compact, deterministic embedded control. Within the broader taxonomy, the S9S08DZ60F1MLF sits in the chain: 8-bit MCU -> HCS08 family -> S08DZ sub-family -> automotive-grade peripheral-rich MCU -> embedded microcontroller, providing a balance of deterministic real-time control and peripheral integration for cost-sensitive applications.
Key features include 60 KB of FLASH program memory, 4 KB of RAM, 39 I/O, the enhanced HCS08 core with BGND debug support, and an automotive operating temperature grade (the 'F' suffix and 'LF' tail indicating NXP automotive qualification flow). The 48-LQFP (7x7) package exposes a generous number of I/O for the package size, while the FLASH-based program memory supports in-application reprogramming for field updates and calibration. Peripherals typical of this part include MSCAN (CAN 2.0), two SCIs, one SPI, an 8-channel 12-bit ADC, multiple timer/PWM modules, and an internal voltage regulator.
Typical applications include automotive body and chassis ECUs, CAN-node industrial sensors, HVAC controllers, instrument clusters, white-goods motor control front-ends, and low-cost CAN gateway modules. The wide 3.3 V/5 V tolerance allows the MCU to drop into designs that retain 5 V analog sensor signal chains while still leveraging modern serial interfaces.
When designing with this part, ensure decoupling per the manufacturer recommended layout (typically 100 nF + 4.7 µF near VDD/VSS) and review the BGND/debug pin usage to avoid contention on the shared BKGD/MS pin. For production programming, plan for either in-circuit serial programming (BDM) or the built-in FLASH security features to lock the device after code load.
This page consolidates NXP/Freescale datasheet specifications, distributor pricing, drop-in alternatives within the same LQFP-48 footprint, and practical design notes not assembled in any single distributor listing.
Alternatives de remplacement direct pour S9S08DZ60F1MLF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S08DZ60F1MLF (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, Peripherals, Core Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S9S08DZ60F2MLC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S08DZ60F2MLH
✅ Remplacement direct✓ En stock
$2.45 / unité
Voir la fiche technique →S9S08DZ60F2MLFR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DZ60ACLF
✅ Remplacement direct✓ En stock
$6.85 / unité
Voir la fiche technique →S9S08DZ60F1MLF Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Product Type | 8-Bit Microcontroller (MCU) |
| Core Architecture | HCS08 (enhanced HCS08 core) |
| CPU Speed | 40 MHz (20 MHz bus) |
| Program Memory Size | 60 KB (60K x 8) FLASH |
| RAM Size | 4 KB (4K x 8) |
| Number of I/O Lines | 39 |
| Boîtier / Format | 48-LQFP (7x7 mm) |
| Tension d'alimentation | 3.3 V / 5 V |
| Type de montage | Surface Mount |
| Terminal Form | GULL WING |
| Temperature Grade | Automotive (per part suffix 'F' / 'LF') |
| Instruction Set | HC08 with BGND instruction |
| Oscillator Type | External (per package options) |
| Peripherals | MSCAN (CAN 2.0), SCI, SPI, ADC, Timers |
Configuration des broches de S9S08DZ60F1MLF
| Broche 1 | PTC0 — General-purpose I/O / timer channel |
| Broche 2 | PTC1 — General-purpose I/O / timer channel |
| Broche 3 | PTC2 — General-purpose I/O / timer channel |
| Broche 4 | PTC3 — General-purpose I/O / timer channel |
| Broche 5 | PTC4 — General-purpose I/O / timer channel |
| Broche 6 | PTC5 — General-purpose I/O / timer channel |
| Broche 7 | PTC6 — General-purpose I/O / timer channel |
| Broche 8 | PTC7 — General-purpose I/O / timer channel |
| Broche 9 | VDDA — Analog supply (3.3 V / 5 V) |
| Broche 10 | VSSA — Analog ground |
| Broche 11 | PTB0 — General-purpose I/O / ADC channel |
| Broche 12 | PTB1 — General-purpose I/O / ADC channel |
| Broche 13 | PTB2 — General-purpose I/O / ADC channel |
| Broche 14 | PTB3 — General-purpose I/O / ADC channel |
| Broche 15 | PTB4 — General-purpose I/O / ADC channel |
| Broche 16 | PTB5 — General-purpose I/O / ADC channel |
| Broche 17 | PTB6 — General-purpose I/O / ADC channel |
| Broche 18 | PTB7 — General-purpose I/O / ADC channel |
| Broche 19 | PTA0 — General-purpose I/O |
| Broche 20 | PTA1 — General-purpose I/O |
| Broche 21 | PTA2 — General-purpose I/O |
| Broche 22 | PTA3 — General-purpose I/O |
| Broche 23 | PTA4 — General-purpose I/O |
| Broche 24 | PTA5 — General-purpose I/O |
| Broche 25 | PTA6 — General-purpose I/O |
| Broche 26 | PTA7 — General-purpose I/O |
| Broche 27 | PTD0 — General-purpose I/O / SPI |
| Broche 28 | PTD1 — General-purpose I/O / SPI |
| Broche 29 | PTD2 — General-purpose I/O / SPI |
| Broche 30 | PTD3 — General-purpose I/O / SPI |
| Broche 31 | PTD4 — General-purpose I/O / SPI |
| Broche 32 | PTD5 — General-purpose I/O / SPI |
| Broche 33 | PTD6 — General-purpose I/O |
| Broche 34 | PTD7 — General-purpose I/O |
| Broche 35 | CANRX — MSCAN receive input |
| Broche 36 | CANTX — MSCAN transmit output |
| Broche 37 | BKGD — Background Debug / Mode Select |
| Broche 38 | RESET — External reset input (active low) |
| Broche 39 | VDDR — Internal regulator supply |
| Broche 40 | VSS — Digital ground |
| Broche 41 | VDD — Digital supply (3.3 V / 5 V) |
| Broche 42 | PTE0 — General-purpose I/O |
| Broche 43 | PTE1 — General-purpose I/O |
| Broche 44 | PTE2 — General-purpose I/O |
| Broche 45 | PTE3 — General-purpose I/O |
| Broche 46 | PTE4 — General-purpose I/O |
| Broche 47 | PTE5 — General-purpose I/O |
| Broche 48 | PTE6 — General-purpose I/O / IRQ |
Applications typiques
S9S08DZ60F1MLF convient pour 6 applications: Automotive Body and Chassis ECU, Industrial CAN-Connected Sensor Node, HVAC and Climate Control Module, Instrument Cluster Sub-Controller, White-Goods Motor Control Front-End, Low-Cost CAN Gateway Module.
Automotive Body and Chassis ECU
The S9S08DZ60F1MLF suits body and chassis ECUs (door modules, seat controllers, lighting nodes) because of its integrated MSCAN (CAN 2.0) peripheral, automotive temperature grade, and 39 GPIO lines. The 40 MHz HCS08 core delivers deterministic control loops for actuator PWM and switch debouncing while leaving headroom in the 60 KB FLASH for CAN diagnostics (UDS) and OBD-II stacks. The 48-LQFP footprint gives easy routing to low-side driver FETs and to a CAN transceiver on the same PCB, and the 3.3 V/5 V tolerance allows direct drive of legacy 5 V analog position sensors. Its masked-ROM flow suits high-volume OEM programs where per-unit cost dominates over R&D iteration.
Recommandé
Industrial CAN-Connected Sensor Node
For factory-floor CANOpen or DeviceNet sensor nodes, the S9S08DZ60F1MLF offers the right balance of MCU performance and peripheral integration. The 12-bit on-chip ADC samples analog sensor signals (pressure, level, temperature) while the MSCAN peripheral talks to a PLC over CAN 2.0B at 125 kbps to 1 Mbps. The 39 GPIO lines drive status LEDs, optocouplers, and digital inputs, while 4 KB of RAM is adequate for short CANOpen PDO buffers. The 3.3 V/5 V supply tolerance lets designers pick either modern 3.3 V sensors or retain legacy 5 V analog front-ends, simplifying BOM and reducing hardware re-spin cost.
Recommandé
HVAC and Climate Control Module
HVAC damper and blower controllers benefit from the S9S08DZ60F1MLF's PWM timers, 12-bit ADC for NTC temperature sensing, and CAN connectivity to the body controller. The 40 MHz HCS08 core runs the closed-loop PID for temperature regulation in real time, while the SCI peripheral services a service-tool UART for diagnostics. Automotive temperature grade plus the 48-LQFP package with low thermal resistance allows the part to operate inside the HVAC housing without additional heatsinking. The 60 KB FLASH holds CAN stack plus application logic with room for calibration tables, while the masked-ROM option keeps the BOM cost low in high-volume vehicle programs.
Recommandé
Instrument Cluster Sub-Controller
The S9S08DZ60F1MLF is used as a sub-MCU that drives gauge stepper motors or segment indicators and forwards cluster status to the main processor over CAN. Its PWM and timer peripherals generate the necessary waveforms for stepper motor control, while the SPI peripheral daisy-chains LED drivers. With 39 GPIO available, designers can map multiple stepper channels without external muxing. The deterministic 8-bit core ensures jitter-free gauge movement, and the automotive temperature grade supports under-dash environments. The 48-LQFP footprint and 3.3 V supply simplify integration into existing cluster PCBs.
Recommandé
White-Goods Motor Control Front-End
Washing machines, dishwashers, and refrigerator compressor inverters use the S9S08DZ60F1MLF as a low-cost motor-control front-end. The MCU generates the 6-step or sinusoidal commutation PWM for a 3-phase BLDC motor via its timers, while the on-chip ADC samples back-EMF for sensorless control. SCI serves the user-interface keypad/display, and an optional CAN interface allows communication with the appliance's main controller or service tool. The 60 KB FLASH stores the motor-control state machine plus UI logic, and the masked-ROM flow keeps cost low across high-volume appliance production.
Recommandé
Low-Cost CAN Gateway Module
The S9S08DZ60F1MLF fits compact CAN-to-CAN or CAN-to-LIN gateway modules that bridge body and chassis networks. The MCU runs a small routing table in FLASH and forwards messages between two MSCAN channels (or one MSCAN plus a LIN SCI), with timestamp-based filtering in software. Automotive temperature grade, 48-LQFP footprint, and 3.3 V/5 V tolerance allow the part to be paired with isolated or non-isolated CAN transceivers on a small daughter board. Its 4 KB RAM is sufficient for short message buffers at typical body-network bus loads, and the masked-ROM flow is well-suited to fleet-scale gateway production.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S08DZ60F1MLF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S9S08DZ60F2MLC | S9S08DZ60F2MLH | S9S08DZ60F2MLFR | MC9S08DZ60ACLF |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7) | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same |
| Core / CPU Speed | HCS08 / 40 MHz | HCS08 / 40 MHz | HCS08 / 40 MHz | HCS08 / 40 MHz | HCS08 / 40 MHz |
| FLASH Program Memory | 60 KB | 60 KB | 60 KB | 60 KB | 60 KB |
| RAM Size | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| GPIO Count | 39 | 39 | 39 | 39 | 39 |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| Code Type | Factory-masked ROM (S9 prefix) | Factory-masked ROM (S9 prefix) | Factory-masked ROM (S9 prefix) | Factory-masked ROM (S9 prefix) | FLASH (user-programmable) |
Principaux différenciateurs
- Factory-masked cost-optimized variant (vs MC9S08DZ60ACLF)
- Same 48-LQFP pinout as DZ60 family (vs S9S08DZ60F2MLC)
- Integrated MSCAN 2.0 controller (vs External CAN controller on 8-bit MCU)
Notes de conception
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD/VSS pair and a bulk 4.7 µF tantalum or ceramic near the VDD pin. The S9S08DZ60F1MLF integrates an internal voltage regulator powered via VDDR/VSS; per NXP/Freescale S08DZ60 family documentation, VDDR requires a low-ESR bypass to keep the regulator stable. For noisy automotive supplies, add a ferrite bead or 10 Ω resistor between battery and VDD to suppress load-dump transients.
Route the BKGD/MS and RESET lines away from high-frequency switching nodes (CANH/CANL, PWM outputs) to avoid debug-mode glitches. Expose the BKGD/MS pin to a 2x5 or 1x6 header for BDM programming in production. The 48-LQFP (7x7 mm) package benefits from thermal vias under the exposed pad if used; keep all 48-LQFP signal traces short and matched for CAN, and use a 4-layer PCB with continuous ground plane for best EMC performance in automotive environments.
Do not assume the masked S9S08DZ60F1MLF is interchangeable with the FLASH-based MC9S08DZ60ACLF at the firmware level - the S9 prefix indicates factory-masked ROM with customer code, not user FLASH. For development or low-volume runs, use the MC9S08DZ60ACLF or another MC9S08 variant. Always review the latest NXP errata for the F1 mask revision before locking the design, and verify MSL/JEDEC J-STD-020 rating to choose the correct reflow profile for the production line.
CAN bus termination (120 Ω at each end) and a split termination network (60 Ω + 4.7 nF to ground) improve EMC on CANH/CANL. Keep CAN traces short and impedance-controlled (~120 Ω differential). For SPI peripherals driving cables or long traces, add 22-33 Ω series resistors at the driver to dampen ringing. The on-chip 12-bit ADC benefits from an RC anti-aliasing filter (typically 1 kΩ + 100 pF) on each analog input when sampling fast-switching signals.
Informations de conformité
AEC-Q100 qualification inferred from NXP automotive-grade suffix 'F' / 'LF'. RoHS, REACH, lead-free, halogen-free, and full MSL/JEDEC ratings were not present in the verified web data and require datasheet confirmation - see [DATA_NEEDED] markers in specs.