MC9S08PA16VTG vs MC9S08AC32CFDE Comparaison
Comparaison détaillée côte à côte de MC9S08PA16VTG par NXP Semiconductors et MC9S08AC32CFDE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndComparaison des spécifications
| Paramètre | MC9S08PA16VTG | MC9S08AC32CFDE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2,10 | $3,02 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| Maximum CPU Speed | 20 MHz | — |
| Program Memory Size | 16 KB (16K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 2 KB | — |
| EEPROM Size | 256 bytes | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 14 | — |
| Connectivity | I2C, LINbus, SPI, UART/USART | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| ADC | 10-bit, multi-channel | 8-channel, 10-bit |
| Plage de température de fonctionnement | -40C to +105C | -40 C to +125 C (automotive grade) |
| Boîtier | 16-TSSOP (0.173, 4.40 mm Width) | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| Type de montage | Surface Mount | Surface Mount |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs, per NXP product page) |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Number of I/O Pins | — | 38 |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Communication Interfaces | — | SCI (UART) and SPI |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Largeur du bus de données | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |