MC9S08PA16VTG vs MC9S08AC32CFDE Comparação

Comparação detalhada lado a lado de MC9S08PA16VTG por NXP Semiconductors e MC9S08AC32CFDE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08PA16VTG MC9S08PA16VTG - 8-bit 20MHz S08 MCU, 16KB Flash | NXP

MC9S08PA16VTG - 8-bit 20MHz S08 MCU, 16KB Flash | NXP

MC9S08PA16VTG Nrnd

Comparação de especificações

Parâmetro MC9S08PA16VTG MC9S08AC32CFDE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $2,10 $3,02
Core Processor S08 —
Core Size 8-Bit —
Maximum CPU Speed 20 MHz —
Program Memory Size 16 KB (16K x 8) —
Program Memory Type FLASH —
RAM Size 2 KB —
EEPROM Size 256 bytes —
Supply Voltage Range 2.7 V to 5.5 V —
Number of I/O 14 —
Connectivity I2C, LINbus, SPI, UART/USART —
Peripherals LVD, POR, PWM, WDT —
ADC 10-bit, multi-channel 8-channel, 10-bit
Faixa de temperatura de operação -40C to +105C -40 C to +125 C (automotive grade)
Encapsulamento 16-TSSOP (0.173, 4.40 mm Width) 48-QFN-EP (7x7 mm) with exposed thermal pad
Tipo de montagem Surface Mount Surface Mount
Status do ciclo de vida NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs, per NXP product page)
Core Architecture — S08 (HCS08 family, 8-bit CISC)
Program Memory (Flash) — 32 KB
RAM — 1 KB
Maximum CPU Frequency — 40 MHz
Supply Voltage (VDD) — 2.7 V to 5.5 V
Number of I/O Pins — 38
Timers — 16-bit timer/PWM, plus additional 8-bit and 2-channel modules
Communication Interfaces — SCI (UART) and SPI
Debug Interface — Single-wire BDM (Background Debug Mode)
Internal Clock Source — Yes (ICS - Internal Clock Source)
Temperature Grade — Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter]
Largura do barramento de dados — 8-bit
MSL (Moisture Sensitivity Level) — MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life]
RoHS Compliance — Compliant (per NXP product page)
Lead-Free — Yes (per distributor packaging datasheet)

Fichas técnicas e recursos

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