MC9S08PA16VTG vs MC9S08AC32CFDE Vergleich
Detaillierter Direktvergleich von MC9S08PA16VTG von NXP Semiconductors und MC9S08AC32CFDE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndSpezifikationsvergleich
| Parameter | MC9S08PA16VTG | MC9S08AC32CFDE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,10 | $3,02 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| Maximum CPU Speed | 20 MHz | — |
| Program Memory Size | 16 KB (16K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 2 KB | — |
| EEPROM Size | 256 bytes | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 14 | — |
| Connectivity | I2C, LINbus, SPI, UART/USART | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| ADC | 10-bit, multi-channel | 8-channel, 10-bit |
| Betriebstemperaturbereich | -40C to +105C | -40 C to +125 C (automotive grade) |
| Gehäuse | 16-TSSOP (0.173, 4.40 mm Width) | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| Montageart | Surface Mount | Surface Mount |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs, per NXP product page) |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Number of I/O Pins | — | 38 |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Communication Interfaces | — | SCI (UART) and SPI |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Datenbusbreite | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |