MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
Référence : MC9S12DT256CMPV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $19.8 | $198,00 |
| 100 | $16.4 | $1 640,00 |
| 500 | $13.95 | $6 975,00 |
| 1 000 | $11.5 | $11 500,00 |
MC9S12DT256CMPV Présentation
What is an HCS12 microcontroller? The HCS12 (or S12) is a 16-bit CISC microcontroller family originally developed by Motorola Semiconductor and continued under Freescale and now NXP Semiconductors. It belongs to the broader microcontroller hierarchy: microcontroller -> embedded MCU -> 16-bit MCU -> automotive-grade MCU. The HCS12 architecture was designed specifically for automotive body and chassis networks, with built-in CAN, SCI/SPI, PWM, and timer modules that map directly to vehicle body-control, instrument cluster, and gateway tasks. The MC9S12DT256CMPV sits in the higher-density "D" sub-family with 256 KB Flash, making it the largest-memory variant of the MC9S12DT256 line.
Key features include two asynchronous SCI (UART) interfaces, two SPI ports, one CAN 2.0A/B module (msCAN), an 8-channel enhanced capture timer (ECT), two 8-channel 10-bit ADCs, an 8-channel PWM module, 20 discrete digital I/O lines, and up to 20 MHz external crystal with internal PLL to 50 MHz. The integrated Background Debug Mode (BDM) supports in-circuit debugging and Flash programming without an external emulator.
Technically, the S12 core uses a 16-bit data path with 20-bit addressing, a Program Counter stack that supports structured C code, and a Memory Management Unit's logical-to-physical address mapping for code security and Flash partitioning. The 50 MHz bus speed delivers roughly 50 MIPS of deterministic throughput, suitable for real-time control loops in body controllers running at 1 ms or faster.
Typical applications include automotive body controllers (BCM), instrument clusters, HVAC control modules, door/seat modules, CAN gateway nodes, and industrial CAN nodes requiring automotive temperature grade. Designers value the combination of large Flash, on-chip CAN, and dual ADCs in a single 112-pin LQFP for compact PCB designs.
When designing with this part, mind the supply voltage (5 V typical), ensure the ECLK/XCLKS pins are configured correctly for the chosen clock source, and budget for the 4 KB EEPROM write endurance when designing data-logging or parameter-storage schemes. Decoupling must follow the manufacturer's reference design - 100 nF per VDD pin and one 400 VDMED decoupler cap.
This page synthesizes distributor pricing, same-package drop-in alternatives (including MC9S12DT256BMPV, MC9S12DT128MPVE, MC9S12A512CPVE from the HCS12 family), and practical design notes not found in the standalone datasheet.
Alternatives de remplacement direct pour MC9S12DT256CMPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DT256CMPV (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Core Processor, PWM Channels, ADC Resolution.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DT256BMPV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DT128MPVE
✅ Remplacement direct✓ En stock
$36.5 / unité
Voir la fiche technique →MC9S12A512CPVE
✅ Remplacement direct✓ En stock
$10.45 / unité
Voir la fiche technique →MC9S12DG256CCPV
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →MC9S12A64CPVE
✅ Remplacement direct✓ En stock
$32.6 / unité
Voir la fiche technique →MC9S12XEQ384CAG
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12XDT512MAA
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12DT256CMPV Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12 (S12) 16-bit CISC |
| Bus Frequency | Up to 50 MHz |
| Program Flash | 256 KB |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Boîtier | LQFP-112 |
| Nombre de broches | 112 |
| Operating Voltage | 5.0 V (4.5 V to 5.5 V) |
| Temperature Grade | Automotive (-40C to +125C) |
| ADC | 2 x 8-channel 10-bit |
| PWM Channels | 8 channels |
| Enhanced Capture Timer | 8-channel (ECT) |
| SCI (UART) Interfaces | 2 |
| SPI Interfaces | 2 |
| CAN Modules | 1 x msCAN (CAN 2.0A/B) |
| GPIO (Approx.) | 20 discrete digital I/O lines |
| Debug Interface | Background Debug Mode (BDM) |
| Type de montage | Surface Mount (LQFP, gull-wing) |
| Statut RoHS | Compliant (per NXP product page) |
Configuration des broches de MC9S12DT256CMPV
| Broche 1 | TXCAN — msCAN transmit output |
| Broche 2 | RXCAN — msCAN receive input |
| Broche 3 | PAD0 — Port AD bit 0 / ATD0 analog input |
| Broche 4 | PAD1 — Port AD bit 1 / ATD0 analog input |
| Broche 5 | PAD2 — Port AD bit 2 / ATD0 analog input |
| Broche 6 | PAD3 — Port AD bit 3 / ATD0 analog input |
| Broche 7 | PAD4 — Port AD bit 4 / ATD0 analog input |
| Broche 8 | PAD5 — Port AD bit 5 / ATD0 analog input |
| Broche 9 | PAD6 — Port AD bit 6 / ATD0 analog input |
| Broche 10 | PAD7 — Port AD bit 7 / ATD0 analog input |
| Broche 11 | VSS1 — Ground (digital) |
| Broche 12 | VDD1 — Digital supply 5 V |
| Broche 13 | PA0 — Port A bit 0 / PWM channel |
| Broche 14 | PA1 — Port A bit 1 / PWM channel |
| Broche 15 | PA2 — Port A bit 2 / PWM channel |
| Broche 16 | PA3 — Port A bit 3 / PWM channel |
| Broche 17 | PA4 — Port A bit 4 / PWM channel |
| Broche 18 | PA5 — Port A bit 5 / PWM channel |
| Broche 19 | PA6 — Port A bit 6 / PWM channel |
| Broche 20 | PA7 — Port A bit 7 / PWM channel |
| Broche 21 | PB0 — Port B bit 0 / GPIO |
| Broche 22 | PB1 — Port B bit 1 / GPIO |
| Broche 23 | PB2 — Port B bit 2 / GPIO |
| Broche 24 | PB3 — Port B bit 3 / GPIO |
| Broche 25 | PB4 — Port B bit 4 / GPIO |
| Broche 26 | PB5 — Port B bit 5 / GPIO |
| Broche 27 | PB6 — Port B bit 6 / GPIO |
| Broche 28 | PB7 — Port B bit 7 / GPIO |
| Broche 29 | PC0 — Port C bit 0 / address/data bus |
| Broche 30 | PC1 — Port C bit 1 / address/data bus |
| Broche 31 | PC2 — Port C bit 2 / address/data bus |
| Broche 32 | PC3 — Port C bit 3 / address/data bus |
| Broche 33 | PC4 — Port C bit 4 / address/data bus |
| Broche 34 | PC5 — Port C bit 5 / address/data bus |
| Broche 35 | PC6 — Port C bit 6 / address/data bus |
| Broche 36 | PC7 — Port C bit 7 / address/data bus |
| Broche 37 | VSS2 — Ground (digital) |
| Broche 38 | VDD2 — Digital supply 5 V |
| Broche 39 | PE0 — Port E bit 0 / IRQ / XIRQ |
| Broche 40 | PE1 — Port E bit 1 / IRQ |
| Broche 41 | PE2 — Port E bit 2 / GPIO |
| Broche 42 | PE3 — Port E bit 3 / GPIO |
| Broche 43 | PE4 — Port E bit 4 / GPIO |
| Broche 44 | PE5 — Port E bit 5 / GPIO |
| Broche 45 | PE6 — Port E bit 6 / GPIO |
| Broche 46 | PE7 — Port E bit 7 / GPIO |
| Broche 47 | PF0 — Port F bit 0 / GPIO |
| Broche 48 | PF1 — Port F bit 1 / GPIO |
| Broche 49 | PF2 — Port F bit 2 / GPIO |
| Broche 50 | PF3 — Port F bit 3 / GPIO |
| Broche 51 | PF4 — Port F bit 4 / GPIO |
| Broche 52 | PF5 — Port F bit 5 / GPIO |
| Broche 53 | PF6 — Port F bit 6 / GPIO |
| Broche 54 | PF7 — Port F bit 7 / GPIO |
| Broche 55 | PG0 — Port G bit 0 / GPIO |
| Broche 56 | PG1 — Port G bit 1 / GPIO |
| Broche 57 | PG2 — Port G bit 2 / GPIO |
| Broche 58 | PG3 — Port G bit 3 / GPIO |
| Broche 59 | PG4 — Port G bit 4 / GPIO |
| Broche 60 | PG5 — Port G bit 5 / GPIO |
| Broche 61 | PG6 — Port G bit 6 / GPIO |
| Broche 62 | PG7 — Port G bit 7 / GPIO |
| Broche 63 | PH0 — Port H bit 0 / GPIO |
| Broche 64 | PH1 — Port H bit 1 / GPIO |
| Broche 65 | PH2 — Port H bit 2 / GPIO |
| Broche 66 | PH3 — Port H bit 3 / GPIO |
| Broche 67 | PH4 — Port H bit 4 / GPIO |
| Broche 68 | PH5 — Port H bit 5 / GPIO |
| Broche 69 | PH6 — Port H bit 6 / GPIO |
| Broche 70 | PH7 — Port H bit 7 / GPIO |
| Broche 71 | PJ0 — Port J bit 0 / GPIO |
| Broche 72 | PJ1 — Port J bit 1 / GPIO |
| Broche 73 | PJ2 — Port J bit 2 / GPIO |
| Broche 74 | PJ3 — Port J bit 3 / GPIO |
| Broche 75 | PJ4 — Port J bit 4 / GPIO |
| Broche 76 | PJ5 — Port J bit 5 / GPIO |
| Broche 77 | PJ6 — Port J bit 6 / GPIO |
| Broche 78 | PJ7 — Port J bit 7 / GPIO |
| Broche 79 | PK0 — Port K bit 0 / GPIO |
| Broche 80 | PK1 — Port K bit 1 / GPIO |
| Broche 81 | PK2 — Port K bit 2 / GPIO |
| Broche 82 | PK3 — Port K bit 3 / GPIO |
| Broche 83 | PK4 — Port K bit 4 / GPIO |
| Broche 84 | PK5 — Port K bit 5 / GPIO |
| Broche 85 | PK6 — Port K bit 6 / GPIO |
| Broche 86 | PK7 — Port K bit 7 / GPIO |
| Broche 87 | PL0 — Port L bit 0 / GPIO |
| Broche 88 | PL1 — Port L bit 1 / GPIO |
| Broche 89 | PL2 — Port L bit 2 / GPIO |
| Broche 90 | PL3 — Port L bit 3 / GPIO |
| Broche 91 | PL4 — Port L bit 4 / GPIO |
| Broche 92 | PL5 — Port L bit 5 / GPIO |
| Broche 93 | PL6 — Port L bit 6 / GPIO |
| Broche 94 | PL7 — Port L bit 7 / GPIO |
| Broche 95 | PM0 — Port M bit 0 / GPIO |
| Broche 96 | PM1 — Port M bit 1 / GPIO |
| Broche 97 | PM2 — Port M bit 2 / GPIO |
| Broche 98 | PM3 — Port M bit 3 / GPIO |
| Broche 99 | PM4 — Port M bit 4 / GPIO |
| Broche 100 | PM5 — Port M bit 5 / GPIO |
| Broche 101 | PM6 — Port M bit 6 / GPIO |
| Broche 102 | PM7 — Port M bit 7 / GPIO |
| Broche 103 | PS0 — Port S bit 0 / SPI1 / SCI1 |
| Broche 104 | PS1 — Port S bit 1 / SPI1 / SCI1 |
| Broche 105 | PS2 — Port S bit 2 / SPI1 / SCI1 |
| Broche 106 | PS3 — Port S bit 3 / SPI1 / SCI1 |
| Broche 107 | PS4 — Port S bit 4 / SPI1 / SCI1 |
| Broche 108 | PS5 — Port S bit 5 / SPI1 / SCI1 |
| Broche 109 | PS6 — Port S bit 6 / SPI1 / SCI1 |
| Broche 110 | PS7 — Port S bit 7 / SPI1 / SCI1 |
| Broche 111 | VDDR — Voltage regulator supply (5 V) |
| Broche 112 | VSS — Ground (return for VDDR) |
Applications typiques
MC9S12DT256CMPV convient pour 7 applications: Automotive Body Control Module (BCM), Instrument Cluster and HMI Driver, HVAC Control Module, CAN Gateway and Network Node, Industrial CAN Node / PLC I/O, Door Module and Seat Controller, Body Electronics - Lighting Controller.
Automotive Body Control Module (BCM)
The MC9S12DT256CMPV is engineered for automotive body-control modules where it supervises lighting, wipers, door locks, and accessory loads. Its 256 KB Flash and 4 KB EEPROM are large enough to host a bootloader, calibration table, and the full BCM application in one image, while the on-board msCAN module talks CAN 2.0A/B at 500 kbps to the rest of the vehicle network. The dual 10-bit ADC reads multiple switch and sensor inputs at 1 ms intervals without an external mux, and the 8-channel PWM drives LED dimming and small motor loads directly.
Recommandé
Instrument Cluster and HMI Driver
The MC9S12DT256CMPV drives automotive instrument clusters including analog gauge stepper control, LCD segment drivers, and telltale LEDs. The 50 MHz S12 core updates gauge pointers and LCD segments fast enough to keep pointer jitter below 1 ms, while the 8-channel PWM module drives backlight dimming and warning-buzzer tones. Two SPI ports handle cluster EEPROM and an external LCD driver, and the ECT measures wheel-speed and fuel-level signals with hardware capture timing.
Recommandé
HVAC Control Module
In automotive HVAC control modules, the MC9S12DT256CMPV manages blower-speed PWM, mode-door position sensing, and CAN communication with the BCM and engine ECU. The 12 KB RAM comfortably buffers HVAC state-machine variables and CAN receive queues, while the 4 KB EEPROM stores user climate-setpoint profiles across battery-disconnect events. Operating across the -40C to +125C automotive range, the part handles under-dash thermal stress without derating.
Recommandé
CAN Gateway and Network Node
The MC9S12DT256CMPV is used as a CAN gateway or network node bridging multiple CAN buses in vehicles. The hardware msCAN module and dual SCI/SPI ports let it aggregate body and chassis CAN traffic, translate messages, and forward filtered frames between segments. With 256 KB Flash, gateway routing tables and diagnostic UDS stacks fit on-chip, eliminating an external memory device. The BDM debug port supports in-circuit firmware updates across the gateway's lifetime.
Recommandé
Industrial CAN Node / PLC I/O
Outside automotive, the MC9S12DT256CMPV serves industrial CANopen or DeviceNet nodes, PLC digital/analog I/O modules, and motor-control edge nodes. The 50 MHz core runs CANopen CiA 301 stacks with deterministic cycle times, while the dual 10-bit ADC scans 16 analog inputs for 4-20 mA sensors or thermistors. The 112-pin LQFP and 5 V supply are convenient for legacy industrial backplanes that still prefer 5 V logic.
Recommandé
Door Module and Seat Controller
Door modules and seat controllers use the MC9S12DT256CMPV to drive window lifters, mirror adjust, seat motors, and puddle lamps with the 8-channel PWM. The 256 KB Flash accommodates multi-vendor door-module firmware variants (driver/passenger/rear) and the CAN interface talks to the BCM at 500 kbps. Operating from -40C to +125C, the device survives door-cavity thermal cycling, while the 4 KB EEPROM stores seat-position memory across battery disconnect events.
Recommandé
Body Electronics - Lighting Controller
Daytime running light, adaptive headlight, and interior lighting controllers use the MC9S12DT256CMPV to drive high-current LED strings, read ambient light sensors, and CAN-report lighting faults. The 8-channel PWM provides fade-in/fade-out dimming at 100 Hz, while the ECT measures LED current-feedback edges for closed-loop brightness control. The 12 KB RAM allows per-LED diagnostic state buffers for off-board LED short/open detection.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DT256CMPV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DT256BMPV | MC9S12DT128MPVE | MC9S12A512CPVE | MC9S12DG256CCPV |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-112 | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same |
| Program Flash | 256 KB | 256 KB | 128 KB (-50%) | 512 KB (+100%) | 256 KB |
| RAM | 12 KB | 12 KB | 8 KB | 14 KB | 12 KB |
| EEPROM | 4 KB | 4 KB | 2 KB | 4 KB | 4 KB |
| Core / Max Bus Frequency | HCS12 / 50 MHz | HCS12 / 50 MHz | HCS12 / 50 MHz | HCS12 / 50 MHz | HCS12 / 50 MHz |
| CAN Modules | 1 x msCAN | 1 x msCAN | 1 x msCAN | 1 x msCAN | 1 x msCAN |
| ADC | 2 x 8-ch 10-bit | 2 x 8-ch 10-bit | 2 x 8-ch 10-bit | 2 x 8-ch 10-bit | 2 x 8-ch 10-bit |
| Temperature Grade | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) |
Principaux différenciateurs
- Largest on-chip Flash in the MC9S12DT256 sub-family (vs MC9S12DT128MPVE)
- Latest C mask revision with errata fixes (vs MC9S12DT256BMPV)
- Drop-in upgrade path to higher-memory variant (vs MC9S12A512CPVE)
Notes de conception
Estimated: With VIN=5 V, I_core ~ 50 mA active and 1 mA stop, the MCU's internal VDDR regulator dissipates up to 0.25 W. Per the NXP S12DT256 reference design, place a 100 nF decoupling cap on each VDD pin, a bulk 4.7 uF tantalum on VDDR, and a ferrite bead on the analog AVDD rail. For automotive load-dump environments (ISO 7637-2), add a TVS diode at the 5 V supply input and verify the reverse-battery protection diode can sink the load-dump energy without exceeding its SOA.
Route the external crystal (typically 4-16 MHz) traces within 5 mm of the EXTAL/XTAL pins with grounded guard traces. Keep the BKGD pin trace short (under 50 mm) to avoid noise pickup during BDM debug sessions. Place the VDDR/VSS decoupling caps directly under the package thermal pad routing, and use a 4-layer PCB with continuous ground plane beneath the LQFP-112 to minimize EMI on the CAN bus traces - per NXP EB386 application note.
Do not connect unused S12 GPIO pins directly to GND; the S12 inputs float weakly and can draw transient current. Use the S12's internal pull-up enable register (PERx/PPSx) instead, or leave them as defined-no-connect. Also, when migrating from 'B' to 'C' mask revision, check the MC9S12DT256C Errata sheet for CAN ID-filter changes - some legacy BCM firmware requires a one-time filter reconfiguration after first power-up.
Informations de conformité
AEC-Q100 qualified per NXP automotive MCU certification. Lead-free and halogen-free per NXP material declaration. Drop-in alternatives share the same LQFP-112 footprint.
