MCF5307CAI66B vs MCF5329CVM240 Comparaison
Comparaison détaillée côte à côte de MCF5307CAI66B par NXP Semiconductors et MCF5329CVM240 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors
MCF5307CAI66B ⚠ Dernier achatComparaison des spécifications
| Paramètre | MCF5307CAI66B | MCF5329CVM240 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $34,80 | $25,60 |
| Core | ColdFire V3 | — |
| Largeur du bus de données | 32 bit | — |
| Fréquence d'horloge maximale | 66 MHz | 240 MHz |
| Performance | 70 MIPS | — |
| Instruction Set Architecture | ColdFire (variable-length RISC, 68k-derived) | — |
| On-chip SRAM | 4 KB | 32 KB |
| On-chip ROM | ROMless | — |
| Tension d'alimentation | 3.3 V | 1.5 V core / 3.3 V I/O (typical, refer to datasheet) |
| Température de fonctionnement | -40C to +85C | -40C to +85C (industrial) |
| Boîtier | 208-FQFP (28x28 mm) | 256-LBGA (MAPBGA) |
| Type de montage | Surface Mount | Surface Mount |
| MAC Unit | Yes (integrated multiply-accumulate) | — |
| DRAM Controller | Yes (integrated) | — |
| DMA Controller | Yes | — |
| UART | 2 | — |
| Process Node | 0.35 um | — |
| Tray Quantity | Per manufacturer tray standard | — |
| Statut RoHS | Compliant | Compliant |
| Core Architecture | — | ColdFire V3 (VLRISC) |
| Core Bit Width | — | 32-bit |
| Unified Cache | — | 16 KB write-back |
| Program Memory Type | — | ROMless (external memory bus required) |
| Number of I/O Lines | — | 94 |
| Oscillator Type | — | External |
| LCD Controller | — | Integrated (TFT/STN, first integrated LCD on ColdFire) |
| Ethernet | — | 10/100 MAC integrated |
| USB | — | USB 2.0 Full-Speed OTG |
| Debug Interface | — | JTAG/BDM/OnCE |
| Packaging | — | Tray |