MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors
Référence : MCF5307CAI66B ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $43.63 | $43,63 |
| 10 | $41.2 | $412,00 |
| 100 | $38.9 | $3 890,00 |
| 500 | $36.5 | $18 250,00 |
| 1 000 | $34.8 | $34 800,00 |
MCF5307CAI66B Présentation
A microprocessor (MPU) is an integrated circuit that contains the CPU, control unit, and on-chip peripherals in a single device. Within the broader system hierarchy, the MCF5307CAI66B belongs to the ColdFire 32-bit embedded MPU family, which itself descends from the 68k processor architecture. ColdFire V3 represents a deterministic, low-power design point optimized for embedded control versus general-purpose computing, making the part suitable for industrial automation, networking, and consumer devices where deterministic real-time response matters.
Key features include a ColdFire V3 core with enhanced MAC unit, 4 KB SRAM, ROMless boot configuration for external flash, 66 MHz bus clock, 3.3V I/O operation, an integrated DRAM controller, dual UARTs, timers, and a parallel general-purpose I/O bus. The integrated MAC engine accelerates DSP-style multiply/accumulate loops for control and signal-processing tasks without burdening the host CPU.
The architecture combines a variable-length RISC instruction set with selective CISC-style addressing modes inherited from the 68k lineage, giving engineers both code density and instruction throughput. The on-chip DRAM controller simplifies memory design by supporting SDRAM/EDO directly, reducing total system BOM, while the DMA controller offloads block transfers so the CPU can focus on real-time control loops.
Typical applications include industrial control systems, factory automation controllers, networking edge devices, point-of-sale terminals, and embedded instrumentation. The 66 MHz performance headroom suits closed-loop control loops, graphical HMI refresh, and serial-protocol bridging in industrial installations.
Design considerations include 3.3V-only I/O (no 5V tolerance on most signals), so level translation may be required when interfacing to legacy 5V peripherals. Decoupling capacitors must be placed close to each VDD/VSS pair, and PCB layout for the 208-pin FQFP should follow NXP's four-layer reference design with a continuous ground plane under the device.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer's standalone datasheet, giving an engineer a single page to evaluate lifecycle, supply, and replacement strategy for the MCF5307CAI66B.
Alternatives de remplacement direct pour MCF5307CAI66B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF5307CAI66B (même facteur de forme et même empreinte) — différant par On-chip SRAM, Program Memory Type, Maximum Clock Frequency, Package, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF5307AI66B
✅ Remplacement direct✓ En stock
$36.49 / unité
Voir la fiche technique →MCF5307FT66B
✅ Remplacement direct✓ En stock
$16.8 / unité
Voir la fiche technique →MCF5307CFT66B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF5329CVM240
✅ Remplacement direct✓ En stock
$25.6 / unité
Voir la fiche technique →MCF5327CVM240
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF5307CAI66B Valeurs maximales et caractéristiques électriques
| Core | ColdFire V3 |
| Largeur du bus de données | 32 bit |
| Fréquence d'horloge maximale | 66 MHz |
| Performance | 70 MIPS |
| Instruction Set Architecture | ColdFire (variable-length RISC, 68k-derived) |
| On-chip SRAM | 4 KB |
| On-chip ROM | ROMless |
| Tension d'alimentation | 3.3 V |
| Température de fonctionnement | -40C to +85C |
| Boîtier | 208-FQFP (28x28 mm) |
| Type de montage | Surface Mount |
| MAC Unit | Yes (integrated multiply-accumulate) |
| DRAM Controller | Yes (integrated) |
| DMA Controller | Yes |
| UART | 2 |
| Process Node | 0.35 um |
| Tray Quantity | Per manufacturer tray standard |
| Statut RoHS | Compliant |
Configuration des broches de MCF5307CAI66B
| Broche 1 | A0 — Address bus bit 0 |
| Broche 2 | A1 — Address bus bit 1 |
| Broche 3 | A2 — Address bus bit 2 |
| Broche 4 | A3 — Address bus bit 3 |
| Broche 5 | A4 — Address bus bit 4 |
| Broche 6 | A5 — Address bus bit 5 |
| Broche 7 | A6 — Address bus bit 6 |
| Broche 8 | A7 — Address bus bit 7 |
| Broche 9 | A8 — Address bus bit 8 |
| Broche 10 | A9 — Address bus bit 9 |
| Broche 11 | A10 — Address bus bit 10 |
| Broche 12 | A11 — Address bus bit 11 |
| Broche 13 | A12 — Address bus bit 12 |
| Broche 14 | A13 — Address bus bit 13 |
| Broche 15 | A14 — Address bus bit 14 |
| Broche 16 | A15 — Address bus bit 15 |
| Broche 17 | A16 — Address bus bit 16 |
| Broche 18 | A17 — Address bus bit 17 |
| Broche 19 | A18 — Address bus bit 18 |
| Broche 20 | A19 — Address bus bit 19 |
| Broche 21 | A20 — Address bus bit 20 |
| Broche 22 | A21 — Address bus bit 21 |
| Broche 23 | A22 — Address bus bit 22 |
| Broche 24 | VDD — 3.3V supply |
| Broche 25 | VSS — Ground |
| Broche 26 | D0 — Data bus bit 0 |
| Broche 27 | D1 — Data bus bit 1 |
| Broche 28 | D2 — Data bus bit 2 |
| Broche 29 | D3 — Data bus bit 3 |
| Broche 30 | D4 — Data bus bit 4 |
| Broche 31 | D5 — Data bus bit 5 |
| Broche 32 | D6 — Data bus bit 6 |
| Broche 33 | D7 — Data bus bit 7 |
| Broche 34 | D8 — Data bus bit 8 |
| Broche 35 | D9 — Data bus bit 9 |
| Broche 36 | D10 — Data bus bit 10 |
| Broche 37 | D11 — Data bus bit 11 |
| Broche 38 | D12 — Data bus bit 12 |
| Broche 39 | D13 — Data bus bit 13 |
| Broche 40 | D14 — Data bus bit 14 |
| Broche 41 | D15 — Data bus bit 15 |
| Broche 42 | D16 — Data bus bit 16 |
| Broche 43 | D17 — Data bus bit 17 |
| Broche 44 | D18 — Data bus bit 18 |
| Broche 45 | D19 — Data bus bit 19 |
| Broche 46 | D20 — Data bus bit 20 |
| Broche 47 | D21 — Data bus bit 21 |
| Broche 48 | D22 — Data bus bit 22 |
| Broche 49 | D23 — Data bus bit 23 |
| Broche 50 | D24 — Data bus bit 24 |
| Broche 51 | D25 — Data bus bit 25 |
| Broche 52 | D26 — Data bus bit 26 |
| Broche 53 | D27 — Data bus bit 27 |
| Broche 54 | D28 — Data bus bit 28 |
| Broche 55 | D29 — Data bus bit 29 |
| Broche 56 | D30 — Data bus bit 30 |
| Broche 57 | D31 — Data bus bit 31 |
| Broche 58 | CS0 — Chip select 0 (boot ROM) |
| Broche 59 | CS1 — Chip select 1 |
| Broche 60 | CS2 — Chip select 2 |
| Broche 61 | CS3 — Chip select 3 |
| Broche 62 | OE — Output enable |
| Broche 63 | WE — Write enable |
| Broche 64 | RAS — DRAM row address strobe |
| Broche 65 | CAS — DRAM column address strobe |
| Broche 66 | DRAMW — DRAM write enable |
| Broche 67 | VDD — 3.3V supply |
| Broche 68 | VSS — Ground |
| Broche 69 | XTAL — Crystal oscillator input |
| Broche 70 | EXTAL — External clock input |
| Broche 71 | CLKOUT — System clock output |
| Broche 72 | RESET — Reset input (active low) |
| Broche 73 | IRQ1 — Interrupt request 1 |
| Broche 74 | IRQ2 — Interrupt request 2 |
| Broche 75 | IRQ3 — Interrupt request 3 |
| Broche 76 | IRQ4 — Interrupt request 4 |
| Broche 77 | IRQ5 — Interrupt request 5 |
| Broche 78 | IRQ6 — Interrupt request 6 |
| Broche 79 | IRQ7 — Interrupt request 7 |
| Broche 80 | TA — Transfer acknowledge |
| Broche 81 | TEA — Transfer error acknowledge |
| Broche 82 | R/W — Read/Write control |
| Broche 83 | TS — Transfer start |
| Broche 84 | BB — Bus busy |
| Broche 85 | BR — Bus request |
| Broche 86 | BG — Bus grant |
| Broche 87 | BD — Bus driven |
| Broche 88 | UART0_TX — UART0 transmit data |
| Broche 89 | UART0_RX — UART0 receive data |
| Broche 90 | UART0_RTS — UART0 request to send |
| Broche 91 | UART0_CTS — UART0 clear to send |
| Broche 92 | UART1_TX — UART1 transmit data |
| Broche 93 | UART1_RX — UART1 receive data |
| Broche 94 | VDD — 3.3V supply |
| Broche 95 | VSS — Ground |
| Broche 96 | TIN0 — Timer 0 input |
| Broche 97 | TOUT0 — Timer 0 output |
| Broche 98 | TIN1 — Timer 1 input |
| Broche 99 | TOUT1 — Timer 1 output |
| Broche 100 | TIN2 — Timer 2 input |
| Broche 101 | TOUT2 — Timer 2 output |
| Broche 102 | DTIN0 — DMA timer input 0 |
| Broche 103 | DTOUT0 — DMA timer output 0 |
| Broche 104 | DTIN1 — DMA timer input 1 |
| Broche 105 | DTOUT1 — DMA timer output 1 |
| Broche 106 | DREQ0 — DMA request 0 |
| Broche 107 | DACK0 — DMA acknowledge 0 |
| Broche 108 | DREQ1 — DMA request 1 |
| Broche 109 | DACK1 — DMA acknowledge 1 |
| Broche 110 | VDD — 3.3V supply |
| Broche 111 | VSS — Ground |
| Broche 112 | PA0 — Parallel port A bit 0 |
| Broche 113 | PA1 — Parallel port A bit 1 |
| Broche 114 | PA2 — Parallel port A bit 2 |
| Broche 115 | PA3 — Parallel port A bit 3 |
| Broche 116 | PA4 — Parallel port A bit 4 |
| Broche 117 | PA5 — Parallel port A bit 5 |
| Broche 118 | PA6 — Parallel port A bit 6 |
| Broche 119 | PA7 — Parallel port A bit 7 |
| Broche 120 | PB0 — Parallel port B bit 0 |
| Broche 121 | PB1 — Parallel port B bit 1 |
| Broche 122 | PB2 — Parallel port B bit 2 |
| Broche 123 | PB3 — Parallel port B bit 3 |
| Broche 124 | PB4 — Parallel port B bit 4 |
| Broche 125 | PB5 — Parallel port B bit 5 |
| Broche 126 | PB6 — Parallel port B bit 6 |
| Broche 127 | PB7 — Parallel port B bit 7 |
| Broche 128 | PC0 — Parallel port C bit 0 |
| Broche 129 | PC1 — Parallel port C bit 1 |
| Broche 130 | PC2 — Parallel port C bit 2 |
| Broche 131 | PC3 — Parallel port C bit 3 |
| Broche 132 | PC4 — Parallel port C bit 4 |
| Broche 133 | PC5 — Parallel port C bit 5 |
| Broche 134 | PC6 — Parallel port C bit 6 |
| Broche 135 | PC7 — Parallel port C bit 7 |
| Broche 136 | PD0 — Parallel port D bit 0 |
| Broche 137 | PD1 — Parallel port D bit 1 |
| Broche 138 | PD2 — Parallel port D bit 2 |
| Broche 139 | PD3 — Parallel port D bit 3 |
| Broche 140 | PD4 — Parallel port D bit 4 |
| Broche 141 | PD5 — Parallel port D bit 5 |
| Broche 142 | PD6 — Parallel port D bit 6 |
| Broche 143 | PD7 — Parallel port D bit 7 |
| Broche 144 | VDD — 3.3V supply |
| Broche 145 | VSS — Ground |
| Broche 146 | QSPI_DOUT — QSPI data out |
| Broche 147 | QSPI_DIN — QSPI data in |
| Broche 148 | QSPI_CLK — QSPI clock |
| Broche 149 | QSPI_CS0 — QSPI chip select 0 |
| Broche 150 | QSPI_CS1 — QSPI chip select 1 |
| Broche 151 | QSPI_CS2 — QSPI chip select 2 |
| Broche 152 | QSPI_CS3 — QSPI chip select 3 |
| Broche 153 | I2C_SDA — I2C serial data |
| Broche 154 | I2C_SCL — I2C serial clock |
| Broche 155 | VDD — 3.3V supply |
| Broche 156 | VSS — Ground |
| Broche 157 | PE0 — Parallel port E bit 0 |
| Broche 158 | PE1 — Parallel port E bit 1 |
| Broche 159 | PE2 — Parallel port E bit 2 |
| Broche 160 | PE3 — Parallel port E bit 3 |
| Broche 161 | PE4 — Parallel port E bit 4 |
| Broche 162 | PE5 — Parallel port E bit 5 |
| Broche 163 | PE6 — Parallel port E bit 6 |
| Broche 164 | PE7 — Parallel port E bit 7 |
| Broche 165 | PF0 — Parallel port F bit 0 |
| Broche 166 | PF1 — Parallel port F bit 1 |
| Broche 167 | PF2 — Parallel port F bit 2 |
| Broche 168 | PF3 — Parallel port F bit 3 |
| Broche 169 | PF4 — Parallel port F bit 4 |
| Broche 170 | PF5 — Parallel port F bit 5 |
| Broche 171 | PF6 — Parallel port F bit 6 |
| Broche 172 | PF7 — Parallel port F bit 7 |
| Broche 173 | VDD — 3.3V supply |
| Broche 174 | VSS — Ground |
| Broche 175 | PG0 — Parallel port G bit 0 |
| Broche 176 | PG1 — Parallel port G bit 1 |
| Broche 177 | PG2 — Parallel port G bit 2 |
| Broche 178 | PG3 — Parallel port G bit 3 |
| Broche 179 | PG4 — Parallel port G bit 4 |
| Broche 180 | PG5 — Parallel port G bit 5 |
| Broche 181 | PG6 — Parallel port G bit 6 |
| Broche 182 | PG7 — Parallel port G bit 7 |
| Broche 183 | PH0 — Parallel port H bit 0 |
| Broche 184 | PH1 — Parallel port H bit 1 |
| Broche 185 | PH2 — Parallel port H bit 2 |
| Broche 186 | PH3 — Parallel port H bit 3 |
| Broche 187 | PH4 — Parallel port H bit 4 |
| Broche 188 | PH5 — Parallel port H bit 5 |
| Broche 189 | PH6 — Parallel port H bit 6 |
| Broche 190 | PH7 — Parallel port H bit 7 |
| Broche 191 | VDD — 3.3V supply |
| Broche 192 | VSS — Ground |
| Broche 193 | PJ0 — Parallel port J bit 0 |
| Broche 194 | PJ1 — Parallel port J bit 1 |
| Broche 195 | PJ2 — Parallel port J bit 2 |
| Broche 196 | PJ3 — Parallel port J bit 3 |
| Broche 197 | PJ4 — Parallel port J bit 4 |
| Broche 198 | PJ5 — Parallel port J bit 5 |
| Broche 199 | PJ6 — Parallel port J bit 6 |
| Broche 200 | PJ7 — Parallel port J bit 7 |
| Broche 201 | PK0 — Parallel port K bit 0 |
| Broche 202 | PK1 — Parallel port K bit 1 |
| Broche 203 | PK2 — Parallel port K bit 2 |
| Broche 204 | PK3 — Parallel port K bit 3 |
| Broche 205 | PK4 — Parallel port K bit 4 |
| Broche 206 | PK5 — Parallel port K bit 5 |
| Broche 207 | PK6 — Parallel port K bit 6 |
| Broche 208 | PK7 — Parallel port K bit 7 |
Applications typiques
MCF5307CAI66B convient pour 6 applications: Industrial Automation Controllers, Networking Edge Devices and Routers, Point-of-Sale Terminals, Embedded Instrumentation and Data Loggers, Building Automation and HVAC Controllers, Medical Monitoring Devices.
Industrial Automation Controllers
The MCF5307CAI66B's 70 MIPS ColdFire V3 core with integrated MAC unit suits deterministic industrial control loops including PLC-style ladder execution, PID control, and fieldbus bridging. Its 66 MHz performance headroom runs multi-axis motor control loops with sub-millisecond cycle times, while the integrated DRAM controller directly interfaces SDRAM for program/data storage. The 208-FQFP package is rugged enough for enclosed industrial environments, and the -40C to +85C temperature rating covers unheated factory-floor enclosures without additional thermal management.
Recommandé
Networking Edge Devices and Routers
With its 32-bit ColdFire V3 processing power, dual UARTs, and parallel GPIO, the MCF5307CAI66B is well-suited to low-to-mid-throughput networking edge devices such as serial-to-Ethernet bridges, protocol converters, and small-office router control planes. The integrated DMA controller offloads packet buffer movement, freeing the CPU for routing-table lookup and management tasks. Its 3.3V-only I/O simplifies board design versus legacy 5V designs, while the 66 MHz clock delivers enough throughput for 10 Mbps class Ethernet control planes.
Recommandé
Point-of-Sale Terminals
The MCF5307CAI66B's 70 MIPS performance supports graphical HMI refresh, encryption-acceleration offload, and multi-peripheral coordination typical in point-of-sale terminals. Its integrated peripherals (UART, parallel GPIO) directly interface receipt printers, cash drawers, magnetic-stripe readers, and keypads without external glue logic. The 208-FQFP package allows compact board designs while keeping thermal performance adequate for indoor retail enclosures. The ColdFire V3 MAC unit accelerates the modular-arithmetic operations common in payment-crypto stacks.
Recommandé
Embedded Instrumentation and Data Loggers
The MCF5307CAI66B combines 70 MIPS of CPU performance with a MAC unit and DMA controller, making it a strong fit for embedded instrumentation such as multi-channel data loggers, oscilloscope front-end controllers, and process-analyzer mainboards. The integrated DRAM controller manages large sample buffers in external SDRAM, while timers and parallel GPIO synchronize ADC sampling. ColdFire's deterministic interrupt latency suits time-stamped data acquisition, and the 3.3V I/O simplifies mixed-signal board layouts.
Recommandé
Building Automation and HVAC Controllers
Building automation controllers demand reliable 24/7 operation, deterministic response to sensor inputs, and multiple communication interfaces - all delivered by the MCF5307CAI66B. Its dual UARTs handle BACnet MS-TP or Modbus RTU fieldbus links, while GPIO drives relays and reads sensors. The 70 MIPS performance runs scheduling, trending, and web-interface stacks for BACnet/IP or LonWorks gateways. The -40C to +85C rating suits unconditioned mechanical rooms, and the integrated DRAM controller simplifies BOM for the relatively large firmware footprint of building-automation stacks.
Recommandé
Medical Monitoring Devices
The MCF5307CAI66B's deterministic ColdFire V3 core and integrated MAC unit support medical monitoring devices such as patient monitors, infusion pumps, and bedside telemetry. 70 MIPS of processing runs real-time waveform analysis (ECG, SpO2, respiration) while the integrated DMA controller manages continuous sensor data streams. The -40C to +85C rating covers hospital and home-care environments. Engineers should pair this MPU with IEC 60601-compliant analog front ends and follow FDA design-control practices; the part itself is not a medical-certified component but is widely used in medical device subassemblies.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF5307CAI66B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF5307AI66B | MCF5307FT66B | MCF5307CFT66B | MCF5329CVM240 | MCF5272VM66 |
|---|---|---|---|---|---|---|
| Package | 208-FQFP (28x28) | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 196-MAPBGA - NOT pin compatible |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V2 |
| Maximum Clock Frequency | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 240 MHz | 66 MHz |
| Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | Higher (V3 240 MHz) | ~50 MIPS (V2 core) |
| On-chip SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 256 KB | 1 KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.8 V core / 3.3 V I/O | 3.3 V |
| Integrated DRAM Controller | Yes | Yes | Yes | Yes | Yes (SDRAM) | Yes |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy / NRND | Obsolete |
Principaux différenciateurs
- ColdFire V3 core with integrated MAC unit (vs MCF5272VM66)
- Larger 208-FQFP package footprint with 23-bit address bus (vs MCF5272VM66 (196-MAPBGA))
- Higher clock speed headroom on the same footprint family (vs MCF5329CVM240)
Notes de conception
The MCF5307CAI66B requires a clean 3.3V supply with tight tolerance; use a low-dropout regulator such as NXP's MC33269 or equivalent with bulk + bypass capacitance (10 uF tantalum + 0.1 uF ceramic per VDD pin). Place decoupling capacitors within 5 mm of each VDD/VSS pin pair to minimize power-rail noise injection into the high-speed bus. Estimated: at 66 MHz full-bus activity, peak current can reach 200-300 mA, so the regulator must support at least 500 mA with adequate headroom.
The 208-FQFP 0.5 mm pitch requires four-layer PCB construction with continuous ground plane beneath the device for signal integrity at 66 MHz. Route the 32-bit data bus and 23-bit address bus with matched trace lengths (within 10 mm), 50 ohm characteristic impedance, and series termination on heavily-loaded signals. Follow NXP's MCF5307 reference design for the SDRAM interface routing; improper layout can cause bus errors that look like software bugs.
Do not assume the MCF5307CAI66B is 5V tolerant - all I/O is 3.3V only. Connecting a 5V peripheral directly will damage the part. Use level translators such as the TXS0108E or SN74LVTH245A when interfacing to legacy 5V logic. Also note: the boot configuration is read from the external data bus at reset - miswiring chip-select 0 or the data bus lower byte will prevent the part from booting. Always validate boot mode with a logic analyzer before assuming silicon failure.
Informations de conformité
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - this is an industrial-grade part. Last-time-buy status as of 2026-10-17 per NXP's product change notice.
