MCZ33903CD5EK vs MCZ33903BD3EK Comparaison
Comparaison détaillée côte à côte de MCZ33903CD5EK par NXP Semiconductors et MCZ33903BD3EK par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MCZ33903CD5EK - SBC with HS-CAN & LIN, 5V LDO | NXP
MCZ33903CD5EK ⚠ Dernier achatComparaison des spécifications
| Paramètre | MCZ33903CD5EK | MCZ33903BD3EK |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Voltage Regulators | Specialized Power ICs |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3,05 | $4,10 |
| Fonction | System Basis Chip (SBC) with HS-CAN and LIN | — |
| CAN Interface | ISO 11898-2 / ISO 11898-5 High-Speed CAN | High-Speed CAN, Normal/Sleep modes, ISO 11898 |
| LIN Interface | LIN 2.0 / LIN 2.1 / SAE J2602 | LIN 2.x physical layer |
| On-chip LDO Output | 5 V | — |
| LDO Output Current | 200 mA | — |
| Operating Voltage (VBAT) | 5.5 V to 27 V (load dump tolerant to 40 V) | — |
| Low-Side Drivers | 4 x configurable, 1.5 A each | — |
| Maximum CAN Data Rate | 1 Mbps | — |
| Sleep Mode Current | <100 uA (typical) | — |
| Configuration Interface | SPI | — |
| Watchdog | Configurable window watchdog via SPI | — |
| ESD Protection (CAN bus pins) | 8 kV HBM (per datasheet) | — |
| Température de fonctionnement | -40 C to +125 C | -40C to +125C (automotive AEC-Q100 grade [DATA_NEEDED: specific grade]) |
| Boîtier | 32-SSOP-EP (7.50 mm width, exposed pad) | — |
| Type de montage | Surface Mount | Surface Mount |
| AEC-Q100 | Qualified (automotive) | — |
| Statut RoHS | Compliant per NXP product page | [DATA_NEEDED: confirm per lot] |
| Product Type | — | System Basis Chip (SBC Gen2) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Supply Voltage (VCC) | — | 5.5 V to 28 V |
| Auxiliary Regulator Output | — | 3.3 V |
| Boîtier / Format | — | 32-SSOP Exposed Pad (7.50 mm body width) |
| Supplier Device Package | — | 32-SOIC EP |
| SPI Control Interface | — | Yes (configuration, diagnostics, watchdog) |
| Status / Lifecycle | — | End-of-Life / Obsolete per NXP product page |
| Lead-Free Status | — | [DATA_NEEDED: confirm per lot] |
| Original Packaging | — | Tube |