MCZ33903CD5EK vs MCZ33903BD3EK Vergleich
Detaillierter Direktvergleich von MCZ33903CD5EK von NXP Semiconductors und MCZ33903BD3EK von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCZ33903CD5EK - SBC with HS-CAN & LIN, 5V LDO | NXP
MCZ33903CD5EK ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MCZ33903CD5EK | MCZ33903BD3EK |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Voltage Regulators | Specialized Power ICs |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,05 | $4,10 |
| Funktion | System Basis Chip (SBC) with HS-CAN and LIN | — |
| CAN Interface | ISO 11898-2 / ISO 11898-5 High-Speed CAN | High-Speed CAN, Normal/Sleep modes, ISO 11898 |
| LIN Interface | LIN 2.0 / LIN 2.1 / SAE J2602 | LIN 2.x physical layer |
| On-chip LDO Output | 5 V | — |
| LDO Output Current | 200 mA | — |
| Operating Voltage (VBAT) | 5.5 V to 27 V (load dump tolerant to 40 V) | — |
| Low-Side Drivers | 4 x configurable, 1.5 A each | — |
| Maximum CAN Data Rate | 1 Mbps | — |
| Sleep Mode Current | <100 uA (typical) | — |
| Configuration Interface | SPI | — |
| Watchdog | Configurable window watchdog via SPI | — |
| ESD Protection (CAN bus pins) | 8 kV HBM (per datasheet) | — |
| Betriebstemperatur | -40 C to +125 C | -40C to +125C (automotive AEC-Q100 grade [DATA_NEEDED: specific grade]) |
| Gehäuse | 32-SSOP-EP (7.50 mm width, exposed pad) | — |
| Montageart | Surface Mount | Surface Mount |
| AEC-Q100 | Qualified (automotive) | — |
| RoHS-Status | Compliant per NXP product page | [DATA_NEEDED: confirm per lot] |
| Product Type | — | System Basis Chip (SBC Gen2) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Supply Voltage (VCC) | — | 5.5 V to 28 V |
| Auxiliary Regulator Output | — | 3.3 V |
| Gehäuse / Bauform | — | 32-SSOP Exposed Pad (7.50 mm body width) |
| Supplier Device Package | — | 32-SOIC EP |
| SPI Control Interface | — | Yes (configuration, diagnostics, watchdog) |
| Status / Lifecycle | — | End-of-Life / Obsolete per NXP product page |
| Lead-Free Status | — | [DATA_NEEDED: confirm per lot] |
| Original Packaging | — | Tube |