MCZ33903CD5EK vs MCZ33903BD3EK Comparação
Comparação detalhada lado a lado de MCZ33903CD5EK por NXP Semiconductors e MCZ33903BD3EK por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MCZ33903CD5EK - SBC with HS-CAN & LIN, 5V LDO | NXP
MCZ33903CD5EK ⚠ Última compraComparação de especificações
| Parâmetro | MCZ33903CD5EK | MCZ33903BD3EK |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Voltage Regulators | Specialized Power ICs |
| Status do ciclo de vida | Última compra | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $3,05 | $4,10 |
| Função | System Basis Chip (SBC) with HS-CAN and LIN | — |
| CAN Interface | ISO 11898-2 / ISO 11898-5 High-Speed CAN | High-Speed CAN, Normal/Sleep modes, ISO 11898 |
| LIN Interface | LIN 2.0 / LIN 2.1 / SAE J2602 | LIN 2.x physical layer |
| On-chip LDO Output | 5 V | — |
| LDO Output Current | 200 mA | — |
| Operating Voltage (VBAT) | 5.5 V to 27 V (load dump tolerant to 40 V) | — |
| Low-Side Drivers | 4 x configurable, 1.5 A each | — |
| Maximum CAN Data Rate | 1 Mbps | — |
| Sleep Mode Current | <100 uA (typical) | — |
| Configuration Interface | SPI | — |
| Watchdog | Configurable window watchdog via SPI | — |
| ESD Protection (CAN bus pins) | 8 kV HBM (per datasheet) | — |
| Temperatura de operação | -40 C to +125 C | -40C to +125C (automotive AEC-Q100 grade [DATA_NEEDED: specific grade]) |
| Encapsulamento | 32-SSOP-EP (7.50 mm width, exposed pad) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| AEC-Q100 | Qualified (automotive) | — |
| Status RoHS | Compliant per NXP product page | [DATA_NEEDED: confirm per lot] |
| Product Type | — | System Basis Chip (SBC Gen2) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Supply Voltage (VCC) | — | 5.5 V to 28 V |
| Auxiliary Regulator Output | — | 3.3 V |
| Encapsulamento / Caixa | — | 32-SSOP Exposed Pad (7.50 mm body width) |
| Supplier Device Package | — | 32-SOIC EP |
| SPI Control Interface | — | Yes (configuration, diagnostics, watchdog) |
| Status / Lifecycle | — | End-of-Life / Obsolete per NXP product page |
| Lead-Free Status | — | [DATA_NEEDED: confirm per lot] |
| Original Packaging | — | Tube |