MPC565CZP40 vs MPC563MZP56 Comparaison
Comparaison détaillée côte à côte de MPC565CZP40 par NXP Semiconductors et MPC563MZP56 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC565CZP40 - 32-bit PowerPC MCU, 1MB Flash, 40MHz, PBGA-388 | NXP
MPC565CZP40 ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC565CZP40 | MPC563MZP56 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $52,10 | $17,95 |
| Core Architecture | PowerPC MPC5xx (Power Architecture) | PowerPC MPC5xx (32-bit) |
| CPU Core | 32-bit PowerPC with integrated FPU | — |
| Maximum CPU Clock | 40 MHz | — |
| Program Memory | 1 MB Flash (1M x 8) | — |
| SRAM | [DATA_NEEDED: total SRAM size in KB] | — |
| FPU | Yes - IEEE-754 single and double precision | — |
| Operating Voltage | [DATA_NEEDED: VDD core/IO range] | 5 V (typical) |
| Température de fonctionnement | -40C to +85C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| Boîtier | 388-PBGA (27 x 27 mm) | 388-PBGA (27 x 27 mm) |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Family | MPC500 | — |
| Automotive Grade | Yes (AEC-Q100 qualified per family) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | Compliant (per distributor listing) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Peripherals | TouCAN, USIU, TPU, QADC, MIOS, USART | Peripheral pin multiplexing, CAN, SPI, serial interfaces |
| Process Technology | 0.35 micrometer CMOS, 5-metal | — |
| Maximum CPU Frequency | — | 56 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| RAM Size | — | 36 KB |
| Number of I/O Pins | — | [DATA_NEEDED: I/O count] |
| Temperature Grade | — | Standard (P) |
| Code Compression | — | Yes (on-chip) |
| Intermodule Bus | — | Common IMB |
| Debug Interface | — | Background Debug Mode (BDM) |
| Manufacturer | — | NXP USA Inc. (formerly Freescale/Motorola) |