MPC565CZP40 vs MPC563MZP56 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC565CZP40 disebabkan oleh NXP Semiconductors dan MPC563MZP56 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC565CZP40 MPC565CZP40 - 32-bit PowerPC MCU, 1MB Flash, 40MHz, PBGA-388 | NXP

MPC565CZP40 - 32-bit PowerPC MCU, 1MB Flash, 40MHz, PBGA-388 | NXP

MPC565CZP40 ⚠ Bahagian terakhir untuk beli
NXP Semiconductors
MPC563MZP56 MPC563MZP56 - 32-Bit 56MHz PowerPC MCU, 512KB Flash | NXP

MPC563MZP56 - 32-Bit 56MHz PowerPC MCU, 512KB Flash | NXP

MPC563MZP56 Nrnd

Pengandingan Spesifikasi

Parametr MPC565CZP40 MPC563MZP56
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Core Architecture PowerPC MPC5xx (Power Architecture) PowerPC MPC5xx (32-bit)
CPU Core 32-bit PowerPC with integrated FPU —
Maximum CPU Clock 40 MHz —
Program Memory 1 MB Flash (1M x 8) —
SRAM [DATA_NEEDED: total SRAM size in KB] —
FPU Yes - IEEE-754 single and double precision —
Operating Voltage [DATA_NEEDED: VDD core/IO range] 5 V (typical)
Suhu Operasi -40C to +85C (automotive grade) [DATA_NEEDED: operating temperature range]
Kemasan 388-PBGA (27 x 27 mm) 388-PBGA (27 x 27 mm)
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Aras MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Family MPC500 —
Automotive Grade Yes (AEC-Q100 qualified per family) —
Status RoHS [DATA_NEEDED: RoHS compliance] Compliant (per distributor listing)
Lead-Free [DATA_NEEDED: lead-free status] —
Peripherals TouCAN, USIU, TPU, QADC, MIOS, USART Peripheral pin multiplexing, CAN, SPI, serial interfaces
Process Technology 0.35 micrometer CMOS, 5-metal —
Maximum CPU Frequency — 56 MHz
Program Memory (Flash) — 512 KB (512K x 8)
RAM Size — 36 KB
Number of I/O Pins — [DATA_NEEDED: I/O count]
Temperature Grade — Standard (P)
Code Compression — Yes (on-chip)
Intermodule Bus — Common IMB
Debug Interface — Background Debug Mode (BDM)
Manufacturer — NXP USA Inc. (formerly Freescale/Motorola)

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