MPC8247CVRTIEA557 vs MPC8247CZQTIEA Comparaison
Comparaison détaillée côte à côte de MPC8247CVRTIEA557 par NXP Semiconductors et MPC8247CZQTIEA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8247CVRTIEA557 - PowerQUICC II 400MHz MPU, PBGA-516 | NXP
MPC8247CVRTIEA557 NrndNXP Semiconductors
MPC8247CZQTIEA - PowerQUICC II 400MHz MPU, 516-PBGA | NXP
MPC8247CZQTIEA ✗ Fin de vieComparaison des spécifications
| Paramètre | MPC8247CVRTIEA557 | MPC8247CZQTIEA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1,65 | $27,85 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Product Family | PowerQUICC II (MPC82xx) | — |
| Core Architecture | PowerPC G2_LE | 32-bit Power Architecture |
| Core Count | 1 | 1 |
| Bit Width | 32-bit | — |
| Maximum Core Frequency | 400 MHz | — |
| Plage de température de fonctionnement | -40 C to +105 C | — |
| Boîtier | 516-ball PBGA, 27x27 mm | 516-PBGA (TEPBGA) 27x27 mm |
| Package Family | PBGA (Plastic Ball Grid Array) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Communications Processor Module (CPM) | Yes (integrated, with PCI, USB, Fast Ethernet MACs) | — |
| PCI Interface | 32-bit, up to 66 MHz | — |
| USB Interface | USB 1.1 (host and slave) | — |
| Ethernet | Dual 10/100 Mbps Fast Ethernet MACs (via CPM) | Dual 10/100 MII/RMII MAC |
| L1 Cache | 16 KB unified instruction/data | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| AEC-Q100 | Not qualified | — |
| Niveau MSL | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-020) |
| DDR Memory Controller | [DATA_NEEDED: DDR generation and width] | — |
| Series | — | PowerQUICC II |
| Core Processor | — | PowerPC G2_LE |
| Core Speed | — | 400 MHz |
| Température de fonctionnement | — | -40C to +105C (Industrial) |
| Tension d'alimentation | — | 3.3 V core/IO |
| Process Technology | — | 0.13 um CMOS |
| Integrated Peripherals | — | CPM, PCI 2.2, USB 1.1, 2x 10/100 Ethernet MAC |
| SDRAM Controller | — | PC-133 SDRAM, 32-bit data |
| DMA Channels | — | 4 |
| Lifecycle | — | End of Life (per NXP product page) |