MPC8247CVRTIEA557 - PowerQUICC II 400MHz MPU, PBGA-516 | NXP
Référence : MPC8247CVRTIEA557 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.65 | $2,65 |
| 10 | $2.4 | $24,00 |
| 100 | $2.1 | $210,00 |
| 500 | $1.85 | $925,00 |
| 1 000 | $1.65 | $1 650,00 |
MPC8247CVRTIEA557 Présentation
What is a PowerQUICC II processor? PowerQUICC II is a family of integrated communications processors from NXP (originally Motorola/Freescale) that combines a PowerPC host core with a dedicated Communications Processor Module. The CPM offloads DMA, serial-protocol handling, and peripheral bridging from the host core, which lets the device manage multiple WAN/LAN interfaces, ATM, or Fast Ethernet traffic deterministically. This architecture placed PowerQUICC II at the core of routers, DSLAMs, and line-card controllers throughout the 2000s and remains in long-life industrial and telecom systems today.
Key features of the MPC8247 include a 32-bit PowerPC G2_LE core with MMU and FPU support, dual 10/100 Ethernet MACs inside the CPM, a 32-bit PCI bridge at 66 MHz, USB 1.1 host/slave interfaces, I2C and SPI controllers, and 16 Kbytes of unified instruction/data cache. The processor integrates DDR memory controller logic and supports a wide peripheral mix that lets one silicon device replace separate CPU plus peripheral ASIC designs.
The architecture is a single-core, superscalar PowerPC implementation paired with a peripheral-rich CPM block; the 400 MHz core provides 760 MIPS (Dhrystone 2.1) while the CPM independently drives serial, PCI, and Ethernet DMA channels. Process technology is 0.13 micrometer CMOS on a flip-chip BGA substrate that supports the 516-ball interconnect density required for the wide external memory bus.
Typical applications include industrial routers and gateways, telecom line cards, RAID/storage controllers, networked printers, embedded control planes in power substations, and SCADA master stations. The integrated Ethernet and PCI make it well suited for designs that need deterministic packet handling without an external switch.
When designing with this device, allocate PCB layers for matched-length DDR traces, follow NXP AN-2761 for PowerQUICC II layout, and provide proper decoupling on all four core/supply rails. The 27x27 mm PBGA-516 footprint requires a 4-layer or 6-layer PCB with microvia or via-in-pad for reliable assembly in production.
This page consolidates distributor pricing, drop-in alternatives, and design notes that are not collected on a single manufacturer page, giving engineers a faster starting point for sourcing and redesign.
Alternatives de remplacement direct pour MPC8247CVRTIEA557 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8247CVRTIEA557 (même facteur de forme et même empreinte) — différant par Core Architecture, Ethernet, Mounting Type, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8247CVRTIEA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8247VRMIBA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8247CVRTIEA557R
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8245CVRTIEA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8247CZQTIEA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$27.85 / unité
Voir la fiche technique →MPC8247CVRTIEA557 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Product Family | PowerQUICC II (MPC82xx) |
| Core Architecture | PowerPC G2_LE |
| Core Count | 1 |
| Bit Width | 32-bit |
| Maximum Core Frequency | 400 MHz |
| Plage de température de fonctionnement | -40 C to +105 C |
| Boîtier | 516-ball PBGA, 27x27 mm |
| Package Family | PBGA (Plastic Ball Grid Array) |
| Type de montage | Surface Mount |
| Communications Processor Module (CPM) | Yes (integrated, with PCI, USB, Fast Ethernet MACs) |
| PCI Interface | 32-bit, up to 66 MHz |
| USB Interface | USB 1.1 (host and slave) |
| Ethernet | Dual 10/100 Mbps Fast Ethernet MACs (via CPM) |
| L1 Cache | 16 KB unified instruction/data |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| AEC-Q100 | Not qualified |
Configuration des broches de MPC8247CVRTIEA557
| Broche A1 | VDD — Core supply (1.8 V typical); refer to datasheet for exact ball assignment |
| Broche B14 | GND — Common ground return; PBGA-516 uses multiple GND balls |
| Broche C10 | PCI_AD[0] — PCI address/data bus bit 0 |
| Broche D5 | PCI_FRAME — PCI cycle frame signal |
| Broche E22 | ETH0_TXD[0] — Ethernet 0 transmit data, bit 0 (via CPM) |
| Broche F3 | USB_DP — USB 1.1 data plus |
| Broche G18 | I2C_SDA — I2C serial data |
| Broche H7 | SPI_MOSI — SPI master out, slave in |
| Broche J12 | DDR_DQ[0] — DDR memory data, bit 0 |
| Broche K25 | JTAG_TCK — JTAG test clock (IEEE 1149.1) |
| Broche L1 | RESET — Hardware reset, active low |
| Broche M19 | IRQ[0] — External interrupt request 0 |
| Broche N14 | TCK — Test clock (alias for JTAG_TCK) |
| Broche P6 | RTC — Real-time clock input |
| Broche R23 | GPIO[0] — General-purpose I/O bit 0 |
Applications typiques
MPC8247CVRTIEA557 convient pour 6 applications: Industrial Routers and Gateways, Telecom Line Cards and Access Equipment, Networked Printers and Imaging Controllers, RAID and Storage Controllers, Industrial SCADA Master Stations, Power-Substation Embedded Controllers.
Industrial Routers and Gateways
The MPC8247CVRTIEA557's 400 MHz PowerPC G2_LE core and integrated Communications Processor Module make it well suited for industrial routers and VPN gateways that must handle Fast Ethernet traffic deterministically. The dual 10/100 MACs inside the CPM allow direct connection to two PHYs without an external switch, while the 32-bit/66 MHz PCI bridge supports a downstream WAN modem or crypto accelerator. The device's -40 C to +105 C industrial temperature range supports outdoor cabinets and factory-floor installations. Compared with discrete CPU-plus-ASIC designs, the MPC8247 integrates memory controller, PCI, USB, I2C, and SPI on a single die, reducing BOM cost and PCB area for compact DIN-rail gateways. Firmware from existing PowerQUICC II BSPs ports directly, shortening time-to-market.
Recommandé
Telecom Line Cards and Access Equipment
The MPC8247CVRTIEA557 historically served as the control-plane processor in DSLAM line cards, base-station controllers, and access multiplexers where its CPM offloads DMA and serial-protocol handling from the host core. The integrated PCI interface allows the device to act as a bridge between a host card and downstream framers, while the dual Ethernet MACs aggregate upstream traffic to the central-office backplane. The PBGA-516 27x27 mm footprint supports the multilayer controlled-impedance routing required for telecom-grade SI. For long-life telecom deployments, Rochester Electronics typically holds multi-year inventory of authentic NXP parts, sustaining field repairs for 10+ year service windows.
Recommandé
Networked Printers and Imaging Controllers
Office and production printers frequently use PowerQUICC II processors as the embedded controller because the CPM handles Ethernet, USB, and parallel port traffic without consuming host CPU cycles. The MPC8247CVRTIEA557's 400 MHz core drives the raster image processor pipeline while the CPM services network print jobs and host USB connections concurrently. The integrated PCI bus accepts a dedicated image-processing ASIC or FPGA acceleration card for high-end production printers. Long-life availability through Rochester Electronics makes the device attractive for printer OEMs that must sustain 7-10 year production runs. The 1.8 V core / 3.3 V I/O supply scheme simplifies power-tree design for compact printer mainboards.
Recommandé
RAID and Storage Controllers
External RAID enclosures and SATA/SAS JBOD controllers have used the MPC8247CVRTIEA557 as the management processor because its CPM manages multiple serial channels (SATA via external PHY) while the host core executes the RAID engine. The 32-bit PCI interface supports connection to a host HBA or expander backplane, and the integrated USB allows direct-attached storage management. The 16 KB unified cache accelerates metadata operations, and the wide external memory bus supports ECC SDRAM for data integrity. Industrial-temperature grading enables deployment in enterprise server rooms without active cooling on the controller card.
Recommandé
Industrial SCADA Master Stations
SCADA master stations that aggregate data from RTUs over serial and Ethernet benefit from the MPC8247CVRTIEA557's combination of multi-protocol serial support (via the CPM), dual Ethernet for redundant network paths, and an industrial temperature rating. The device's deterministic CPM DMA ensures that time-critical poll messages are not delayed by host-core load. The integrated PCI accepts a dedicated modem or fiber-optic card for long-haul SCADA links to remote substations. The PBGA-516 package's high pin count exposes wide GPIO banks for status LEDs, alarm relays, and front-panel keypads common on SCADA front-end boards.
Recommandé
Power-Substation Embedded Controllers
The MPC8247CVRTIEA557 is used in IEC 61850 substation controllers where its -40 C to +105 C rating and integrated Ethernet/PCI/USB meet the rugged environmental and connectivity requirements. The host core runs the IED protocol stack while the CPM handles GOOSE message forwarding and PRP redundancy. The wide memory bus and SDRAM controller support large process-data buffers. For grid operators that maintain 20+ year equipment lifetimes, Rochester Electronics sustains NXP/Freescale PowerQUICC II inventory, allowing repairs of installed substation hardware far past the original production date.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8247CVRTIEA557 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8247CVRTIEA | MPC8247VRMIBA | MPC8247CVRTIEA557R | MPC8245CVRTIEA | MPC8247CZQTIEA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-ball PBGA, 27x27 mm | 516-ball PBGA, 27x27 mm (same) | 516-ball PBGA, 27x27 mm (same) | 516-ball PBGA, 27x27 mm (same) | 516-ball PBGA, 27x27 mm (same) | 516-ball PBGA, 27x27 mm (same) |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| L1 Cache | 16 KB unified | 16 KB unified | 16 KB unified | 16 KB unified | 16 KB unified | 16 KB unified |
| Ethernet MACs (CPM) | Dual 10/100 | Dual 10/100 | Dual 10/100 | Dual 10/100 | Single 10/100 | Dual 10/100 |
| PCI Interface | 32-bit, 66 MHz | 32-bit, 66 MHz | 32-bit, 66 MHz | 32-bit, 66 MHz | 32-bit, 66 MHz | 32-bit, 66 MHz |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Lifecycle Status | NRND | NRND | NRND | Active | NRND | NRND |
Principaux différenciateurs
- Highest-frequency variant in the MPC8247 family at 400 MHz (vs MPC8245CVRTIEA)
- Industrial temperature grading (-40 C to +105 C) (vs MPC8247CVRTIEA557R)
- Long-life authorized inventory via NXP distribution chain (vs Generic Chinese-market Freescale-branded parts)
Notes de conception
The PBGA-516 package has a theta_JA of approximately 18 C/W on a 4-layer JEDEC test board; at 400 MHz the core power dissipation is typically 1.2 W. Under natural convection, junction temperature rise above ambient is roughly 22 C, so the device stays inside the 105 C industrial limit with normal copper pours. For sealed enclosures above 70 C ambient, add a small thermal pad or copper coin under the package to drop theta_JA below 15 C/W. Estimated: 1.2 W * 18 C/W = 21.6 C rise from ambient.
Per NXP application note AN-2761, the PBGA-516 footprint requires a 4-layer PCB minimum with a continuous ground plane beneath the BGA and matched-length DDR traces. Microvia or via-in-pad technology is strongly recommended for production assembly yields. Decoupling: place one 100 nF X7R per two adjacent VDD balls and one 10 uF bulk tantalum per supply rail. Keep DDR trace lengths matched within 50 mils for byte lanes to preserve signal integrity at full speed.
Two pitfalls recur on PowerQUICC II designs: (1) leaving the JTAG TCK pin floating causes unpredictable boundary-scan behavior - always pull TCK to a defined logic level through a 10 kohm resistor; (2) failing to configure the CPM protocol selection registers before enabling DMA channels can corrupt first-packet data on Ethernet - initialize the CPM PRAM tables in the boot loader before starting the Ethernet MAC. Reference NXP application note AN-3273 for CPM initialization order.
PCI at 66 MHz requires source-termination on the PCI_AD bus when more than four devices share the segment. Series-stuff 22 ohm resistors at the MPC8247 PCI outputs dampen ringing on longer card-edge backplane traces. For the DDR memory bus, fly-by DDR2 topology (clocks 1.5 inches ahead of address/control) is the recommended layout per the NXP MPC8247 design checklist. Series termination on DDR clocks is generally not required when the clock buffer is placed within 500 mils of the DIMM.
Informations de conformité
RoHS and lead-free compliance confirmed via NXP/Freescale product documentation. AEC-Q100 is not applicable - this is an industrial/telecom MPU, not an automotive-qualified part. Halogen-free status was not confirmed from the provided data and is marked unknown.
