MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
Référence : MPC8250ACZUMHBC ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $130 | $1 300,00 |
| 100 | $115 | $11 500,00 |
| 500 | $98.5 | $49 250,00 |
| 1 000 | $85 | $85 000,00 |
MPC8250ACZUMHBC Présentation
A microprocessor (MPU) is an integrated circuit that fetches, decodes, and executes instructions from external memory; it is the central processing unit of an embedded system. The PowerQUICC II architecture sits within the broader taxonomy: MPU -> embedded processor -> 32-bit processor -> communications processor -> PowerPC architecture -> NXP/Freescale PowerQUICC family. MPC82xx devices specifically combine a PowerPC host core with a CPM optimized for ATM, HDLC, Ethernet, and other serial protocols.
Key features include a 32-bit PowerPC G2 core, a 64-bit external data bus, integrated DRAM/SDRAM memory controller, dedicated CPM for communications, 266 MHz core frequency, and 3.3 V I/O with 1.8 V core. The integrated CPM offloads protocol processing from the host CPU, enabling wire-speed handling of multiple WAN/LAN interfaces simultaneously without burdening the PowerPC core.
From an architecture standpoint, the MPC8250 uses a dual-processor paradigm: the PowerPC G2 core handles the OS, control plane, and general-purpose code, while the CPM uses microcoded RISC engines to terminate serial channels. This split lets designers implement routers, DSLAMs, and base-station equipment with deterministic throughput. Per the manufacturer datasheet, the device supports multiple boot and endianness configurations, JTAG boundary scan, and a wide range of memory and peripheral interfaces including PCI and UTOPIA.
Typical applications include telecom routers and DSLAMs, industrial control and factory automation, networking switches, VoIP gateways, and legacy embedded systems requiring PowerPC compatibility. The integrated CPM makes the MPC8250ACZUMHBC particularly well suited where multiple serial channels must be processed deterministically alongside general-purpose processing.
When designing with this part, ensure the PCB supports the large 37.5 x 37.5 mm TBGA footprint, provide adequate decoupling for both 3.3 V and 1.8 V rails, and validate thermal performance given the BGA's thermal resistance. NXP has issued End-of-Life documentation for this part, so design teams should plan for last-time-buy windows or evaluate newer PowerQUICC II successors such as the MPC8260/MPC8270 family.
This page synthesizes distributor pricing, end-of-life status, drop-in alternative options, and practical design considerations that are not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MPC8250ACZUMHBC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8250ACZUMHBC (même facteur de forme et même empreinte) — différant par Data Bus Width, Process Technology, Mounting Type, Number of Cores, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8260ACZUMHBC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
KMPC8250ACZUMHBC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8260ACVVMHBB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8265ACZUMHBC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8270ZUUPEA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8250ACZUMHBC Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | MPC82xx (PowerQUICC II) |
| Core Processor | PowerPC G2 |
| Number of Cores | 1 Core, 32-Bit |
| Co-Processors / DSP | Communications; RISC CPM |
| Speed | 266 MHz |
| Process Technology | 0.25 micron |
| Supply Voltage (I/O) | 3.3 V |
| Core Voltage | 1.8 V |
| Boîtier / Format | 480-TBGA (37.5 x 37.5 mm) |
| Nombre de broches | 480 |
| Largeur du bus de données | 32-bit internal / 64-bit external |
| Architecture | RISC |
| RAM Controllers | DRAM, SDRAM |
| Graphics Acceleration | No |
| Type de montage | Surface Mount (BGA) |
| Statut du cycle de vie | Last Time Buy (NXP EOL announced) |
| Lead Free | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) |
Guide de configuration des broches du MPC8250ACZUMHBC 480-tbga (37.5 x 37.5 mm)
Configuration des broches du MPC8250ACZUMHBC (boîtier 480-tbga (37.5 x 37.5 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8250ACZUMHBC.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8250ACZUMHBC convient pour 6 applications: Telecom Router / DSLAM Line Card, Industrial Control and Factory Automation, VoIP Gateway and Media Processing, Legacy Networking Switch Control Plane, Embedded Computing Platform (PowerPC Software Base), Service Continuation / Last-Time-Buy Stocking.
Telecom Router / DSLAM Line Card
The MPC8250ACZUMHBC fits telecom router and DSLAM line-card designs because its integrated RISC CPM offloads ATM, HDLC, and PPP termination from the host PowerPC core. At 266 MHz with a 64-bit external data bus, it can service multiple WAN channels deterministically while the host CPU runs routing and management stacks. The 480-TBGA package and 3.3 V/1.8 V dual-rail design suit multi-layer line-card PCBs where BGA fanout and decoupling are standard practice. Compared with a software-only solution, the integrated CPM cuts CPU load by 40-60 percent on heavy traffic, enabling higher port density per card.
Recommandé
Industrial Control and Factory Automation
The MPC8250ACZUMHBC suits industrial controllers that require deterministic serial communication alongside general-purpose processing, leveraging its PowerPC G2 host core and RISC CPM for fieldbus and motion-control loops. The 32-bit architecture and integrated DRAM/SDRAM controller simplify memory design for HMI and PLC applications. The 480-TBGA package, while large, provides excellent thermal dissipation for fanless industrial enclosures when paired with adequate PCB copper. Designers should verify the operating-temperature grade against their enclosure ambient, since industrial sites often require -40 C to +85 C support.
Recommandé
VoIP Gateway and Media Processing
In VoIP gateways and media-processing appliances, the MPC8250ACZUMHBC's CPM accelerates multi-channel packet processing while the PowerPC G2 core runs signaling stacks such as SIP and H.323. Its PCI interface supports connection to DSP or audio-codec companion chips for transcoding. The 266 MHz host core and 64-bit data bus handle control-plane traffic and VoIP signaling concurrently. For new builds, the MPC8260 or MPC8270 in the same TBGA family provides more headroom; the MPC8250ACZUMHBC remains a valid choice for maintaining installed gateways.
Recommandé
Legacy Networking Switch Control Plane
The MPC8250ACZUMHBC has long powered control-plane CPUs in managed Layer 2/3 switches, where its PowerPC core runs routing protocols and the CPM manages stacking and management links. The 480-TBGA package accommodates the high pin density required by 64-bit DRAM, PCI, and multiple Ethernet MAC interfaces. With NXP's End-of-Life notice in effect, design teams maintaining legacy switches should stock MPC8250ACZUMHBC inventory and evaluate the MPC8270 family for next-generation control-plane designs in the same footprint.
Recommandé
Embedded Computing Platform (PowerPC Software Base)
Designers building embedded systems on a stable PowerPC software base use the MPC8250ACZUMHBC as a known-quantity host CPU with a deterministic CPM and mature toolchain (GCC, VxWorks, Linux). The integrated DRAM/SDRAM controller simplifies memory topology, and the 0.25-micron process provides predictable timing closure at 266 MHz. The 480-TBGA package demands 6+ layer PCBs and via-in-pad assembly; expect assembly costs to be higher than QFP alternatives but acceptable for medium-volume telecom and industrial products.
Recommandé
Service Continuation / Last-Time-Buy Stocking
Because the MPC8250ACZUMHBC is on NXP's Last Time Buy list, existing product lines must decide between buying final production runs and qualifying a successor. Engineers commonly pair the original with the KMPC8250ACZUMHBC factory-repackaged part for service continuity, since it is electrically and mechanically identical. For new designs, the MPC8260 or MPC8270 family in the same TBGA footprint is preferred to avoid a second life-cycle event within a few years.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8250ACZUMHBC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8260ACZUMHBC | KMPC8250ACZUMHBC | MPC8260ACVVMHBB | MPC8265ACZUMHBC | MPC8270ZUUPEA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5 mm) | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 408-TBGA (37.5x37.5) - same family | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same |
| Core Architecture | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 (next-gen) |
| Clock Speed | 266 MHz | 266 MHz | 266 MHz | 266 MHz | Up to 300 MHz | Up to 400 MHz |
| Process Technology | 0.25 micron | 0.25 micron | 0.25 micron | 0.25 micron | 0.25 micron | 0.13 micron (HiPerMOS7) |
| CPM (Communications Processor Module) | Integrated RISC CPM | Enhanced integrated RISC CPM | Integrated RISC CPM (identical) | Enhanced integrated RISC CPM | Enhanced integrated RISC CPM | Enhanced CPM with HiPerMOS7 microcode |
| Supply Voltage (I/O) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Last Time Buy (NXP EOL announced) | Last Time Buy / EOL | Last Time Buy (factory repackaged) | Last Time Buy / EOL | Last Time Buy / EOL | Active (longer life) |
Principaux différenciateurs
- Integrated RISC Communications Processor Module (CPM) (vs Generic 32-bit MPU without dedicated communications engine)
- Mature PowerPC G2 + PowerQUICC II software ecosystem (vs Newer ARM- or MIPS-based communications MCUs)
- Drop-in evolution within the MPC82xx family (vs Forcing a redesign onto a non-PowerPC platform)
Notes de conception
Estimated: The 480-TBGA at 37.5 x 37.5 mm requires via-in-pad or dog-bone fanout on a 6+ layer PCB. Use a 1 mm ball pitch with 0.5 mm via diameter for escape routing; maintain a continuous reference plane under the BGA to control impedance for the 64-bit external data bus. Place bulk and high-frequency decoupling symmetrically around the BGA perimeter, with 10 uF bulk + 0.1 uF ceramic pairs per power pin per NXP layout guidelines.
Provide separate, well-regulated 3.3 V (I/O) and 1.8 V (core) rails with proper sequencing per NXP's MPC82xx hardware specifications. Estimated: at 266 MHz the device draws significant core current; use low-impedance power planes and place at least four 220 uF bulk capacitors near the package. Add 0.1 uF and 0.01 uF ceramics within 5 mm of each power pin to suppress switching noise that could otherwise couple into the high-speed data bus.
Verify the exact part number suffix before assembly: the MPC8250ACZUMHBC (480-TBGA) is not pin-compatible with the lower-ball-count MPC8260ACVVMHBB (408-TBGA) variants even though they share similar datasheet descriptions. Confirm ball count from the manufacturer's mechanical drawing and use a TBGA socket or land pattern that matches exactly. Because NXP has announced Last Time Buy, also validate that suppliers such as Rochester Electronics or independent distributors are providing traceable, factory-original parts rather than remarked units.
Estimated: With a 0.25-micron process and 266 MHz clock, junction temperature in a sealed enclosure can approach limits without airflow. Provide a thermal pad or copper pour connected to the thermal balls on the BGA underside, and consider a 1-2 C/W heatsink for fanless industrial enclosures. Always compute junction temperature from the actual ambient, theta_JC from the package datasheet, and worst-case core current rather than relying on typical numbers.
Informations de conformité
Lead-free BGA construction noted in datasheet excerpt (LEAD FREE, PLASTIC). Full RoHS, REACH, and halogen-free status not confirmed by the verified web data and marked unknown. AEC-Q100 not applicable for this MPU class.