MPC8260AZUPJDB vs XPC8260CVVIFBC Comparaison
Comparaison détaillée côte à côte de MPC8260AZUPJDB par NXP Semiconductors et XPC8260CVVIFBC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP
MPC8260AZUPJDB ⚠ Dernier achatNXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ ActifComparaison des spécifications
| Paramètre | MPC8260AZUPJDB | XPC8260CVVIFBC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $165,00 | $219,50 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II (MPC8260A HiP4) | PowerQUICC II (PQ II HIP 3) |
| Core | PowerPC G2, single core | — |
| Largeur du bus de données | 32-bit | — |
| Fréquence d'horloge maximale | 300 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Core Supply Voltage | 1.9 V to 2.2 V | 2.5 V |
| I/O Supply Voltage | 3.3 V | — |
| Process Technology | 0.25 micrometer CMOS (HiP4) | — |
| Boîtier | 480-TBGA (37.5 x 37.5 mm) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Communications Processor Module (CPM) | Integrated (FCC, SCC, SMC) | Integrated (per PowerQUICC II architecture) |
| External Bus | 60x bus, 64-bit data | — |
| Statut RoHS | unknown | [DATA_NEEDED: RoHS compliance] |
| Packaging | Tray | Tray |
| Lifecycle | End-of-Life / Last Time Buy (per NXP PCN) | — |
| Processor Type | — | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) |
| Core Architecture | — | PowerPC G2, 1 Core, 32-Bit |
| CPU Clock Speed | — | 200 MHz |
| Boîtier / Format | — | 480-LBGA (TBGA), 37.5 x 37.5 mm |
| Terminal Form | — | Ball |
| Number of Terminals | — | 480 |
| Package Body Material | — | Plastic / Epoxy |
| Manufacturer Lifecycle Source | — | NXP Semiconductors (Freescale/Motorola legacy) |
| Lead Free | — | [DATA_NEEDED: lead-free status] |