MPC8260AZUPJDB vs XPC8260CVVIFBC Comparison
Detailed side-by-side comparison of MPC8260AZUPJDB by NXP Semiconductors and XPC8260CVVIFBC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP
MPC8260AZUPJDB ⚠ Last Time BuyNXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ ActiveSpecification Comparison
| Parameter | MPC8260AZUPJDB | XPC8260CVVIFBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $165.00 | $219.50 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II (MPC8260A HiP4) | PowerQUICC II (PQ II HIP 3) |
| Core | PowerPC G2, single core | — |
| Data Bus Width | 32-bit | — |
| Maximum Clock Frequency | 300 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Core Supply Voltage | 1.9 V to 2.2 V | 2.5 V |
| I/O Supply Voltage | 3.3 V | — |
| Process Technology | 0.25 micrometer CMOS (HiP4) | — |
| Package | 480-TBGA (37.5 x 37.5 mm) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | — |
| Communications Processor Module (CPM) | Integrated (FCC, SCC, SMC) | Integrated (per PowerQUICC II architecture) |
| External Bus | 60x bus, 64-bit data | — |
| RoHS Status | unknown | [DATA_NEEDED: RoHS compliance] |
| Packaging | Tray | Tray |
| Lifecycle | End-of-Life / Last Time Buy (per NXP PCN) | — |
| Processor Type | — | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) |
| Core Architecture | — | PowerPC G2, 1 Core, 32-Bit |
| CPU Clock Speed | — | 200 MHz |
| Package / Case | — | 480-LBGA (TBGA), 37.5 x 37.5 mm |
| Terminal Form | — | Ball |
| Number of Terminals | — | 480 |
| Package Body Material | — | Plastic / Epoxy |
| Manufacturer Lifecycle Source | — | NXP Semiconductors (Freescale/Motorola legacy) |
| Lead Free | — | [DATA_NEEDED: lead-free status] |