MPC8270VRMIBA vs MPC8250ACZQIHBC Comparaison
Comparaison détaillée côte à côte de MPC8270VRMIBA par NXP Semiconductors et MPC8250ACZQIHBC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
MPC8270VRMIBA ✗ Fin de vieNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteComparaison des spécifications
| Paramètre | MPC8270VRMIBA | MPC8250ACZQIHBC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $95,75 | $99,50 |
| Core Architecture | PowerPC G2_LE, 32-bit | PowerPC 603e, 32-Bit RISC |
| Core Frequency | 266 MHz | — |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Number of Cores | 1 | 1 (CPU) + 1 CPM |
| On-Chip Cache | 32 KB | — |
| Core Voltage | 1.45 V to 1.6 V | — |
| I/O Voltage | 3.3 V | — |
| Process Technology | HiPerMOS7, 0.13 micron | 0.25 um CMOS |
| Boîtier | 516-PBGA (27 x 27 mm) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Température de fonctionnement | 0 C to 105 C | -40C to +105C (industrial) |
| Integrated Peripherals | PCI, USB, HDLC, 10/100 Ethernet | — |
| Communications Module | CPM with multi-channel HDLC and ATM | — |
| PCI Interface | PCI 2.2 compliant | — |
| USB Interface | USB 1.1 (function or host with external PHY) | — |
| Ethernet MACs | Up to 3 x 10/100 Ethernet | — |
| Niveau MSL | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors |
| Core Processor | — | PowerPC G2 |
| Clock Speed | — | 200 MHz |
| Largeur du bus de données | — | 64-Bit |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | TEPBGA / Plastic BGA |
| Nombre de broches | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |