MPC8270VRMIBA vs MPC8250ACZQIHBC Comparação
Comparação detalhada lado a lado de MPC8270VRMIBA por NXP Semiconductors e MPC8250ACZQIHBC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
MPC8270VRMIBA ✗ Fim de vidaNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteComparação de especificações
| Parâmetro | MPC8270VRMIBA | MPC8250ACZQIHBC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Fim de vida | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $95,75 | $99,50 |
| Core Architecture | PowerPC G2_LE, 32-bit | PowerPC 603e, 32-Bit RISC |
| Core Frequency | 266 MHz | — |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Number of Cores | 1 | 1 (CPU) + 1 CPM |
| On-Chip Cache | 32 KB | — |
| Core Voltage | 1.45 V to 1.6 V | — |
| I/O Voltage | 3.3 V | — |
| Process Technology | HiPerMOS7, 0.13 micron | 0.25 um CMOS |
| Encapsulamento | 516-PBGA (27 x 27 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Temperatura de operação | 0 C to 105 C | -40C to +105C (industrial) |
| Integrated Peripherals | PCI, USB, HDLC, 10/100 Ethernet | — |
| Communications Module | CPM with multi-channel HDLC and ATM | — |
| PCI Interface | PCI 2.2 compliant | — |
| USB Interface | USB 1.1 (function or host with external PHY) | — |
| Ethernet MACs | Up to 3 x 10/100 Ethernet | — |
| Nível MSL | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors |
| Core Processor | — | PowerPC G2 |
| Clock Speed | — | 200 MHz |
| Largura do barramento de dados | — | 64-Bit |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | TEPBGA / Plastic BGA |
| Contagem de pinos | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |