MPC8270VRMIBA vs MPC8250ACZQIHBC Vergleich
Detaillierter Direktvergleich von MPC8270VRMIBA von NXP Semiconductors und MPC8250ACZQIHBC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
MPC8270VRMIBA ✗ AbgekündigtNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteSpezifikationsvergleich
| Parameter | MPC8270VRMIBA | MPC8250ACZQIHBC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $95,75 | $99,50 |
| Core Architecture | PowerPC G2_LE, 32-bit | PowerPC 603e, 32-Bit RISC |
| Core Frequency | 266 MHz | — |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Number of Cores | 1 | 1 (CPU) + 1 CPM |
| On-Chip Cache | 32 KB | — |
| Core Voltage | 1.45 V to 1.6 V | — |
| I/O Voltage | 3.3 V | — |
| Process Technology | HiPerMOS7, 0.13 micron | 0.25 um CMOS |
| Gehäuse | 516-PBGA (27 x 27 mm) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0 C to 105 C | -40C to +105C (industrial) |
| Integrated Peripherals | PCI, USB, HDLC, 10/100 Ethernet | — |
| Communications Module | CPM with multi-channel HDLC and ATM | — |
| PCI Interface | PCI 2.2 compliant | — |
| USB Interface | USB 1.1 (function or host with external PHY) | — |
| Ethernet MACs | Up to 3 x 10/100 Ethernet | — |
| MSL-Level | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors |
| Core Processor | — | PowerPC G2 |
| Clock Speed | — | 200 MHz |
| Datenbusbreite | — | 64-Bit |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | TEPBGA / Plastic BGA |
| Pin-Anzahl | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |