MPC8272CVRMIBA vs MPC8321CVRADDC Comparaison
Comparaison détaillée côte à côte de MPC8272CVRMIBA par NXP Semiconductors et MPC8321CVRADDC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8272CVRMIBA - 266MHz PowerQUICC II MPU | NXP | SoC
MPC8272CVRMIBA ✗ Fin de vieNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ ActifComparaison des spécifications
| Paramètre | MPC8272CVRMIBA | MPC8321CVRADDC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $62,80 | $20,75 |
| Architecture | PowerPC G2_LE (32-bit) | — |
| Family | PowerQUICC II (MPC82xx) | — |
| Core Count | 1 | — |
| Core Clock Frequency | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Process Technology | 0.13 um | 90 nm CMOS |
| Tension d'alimentation | 3.3 V | 1.8 V / 2.5 V / 3.3 V |
| Température de fonctionnement | -40C to +105C | — |
| Boîtier | 516-PBGA (27x27 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI 2.2, USB, UTOPIA, CPM, SEC 2.0, 2x UART, I2C, SPI | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Memory Interface | 32-bit DDR SDRAM with ECC | — |
| Ethernet | 10/100/1000 MAC via CPM | — |
| Security Engine | SEC 2.0 (DES, 3DES, AES, SHA-1, MD-5) | — |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance status] |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core | — | PowerPC e300c2 |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Plage de température de fonctionnement | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Encryption / SEC Block | — | Not included (non-E variant) |