MPC8272CVRMIBA vs MPC8321CVRADDC Comparison
Detailed side-by-side comparison of MPC8272CVRMIBA by NXP Semiconductors and MPC8321CVRADDC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8272CVRMIBA - 266MHz PowerQUICC II MPU | NXP | SoC
MPC8272CVRMIBA ✗ End of LifeNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ ActiveSpecification Comparison
| Parameter | MPC8272CVRMIBA | MPC8321CVRADDC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $62.80 | $20.75 |
| Architecture | PowerPC G2_LE (32-bit) | — |
| Family | PowerQUICC II (MPC82xx) | — |
| Core Count | 1 | — |
| Core Clock Frequency | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Process Technology | 0.13 um | 90 nm CMOS |
| Supply Voltage | 3.3 V | 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | -40C to +105C | — |
| Package | 516-PBGA (27x27 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI 2.2, USB, UTOPIA, CPM, SEC 2.0, 2x UART, I2C, SPI | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Memory Interface | 32-bit DDR SDRAM with ECC | — |
| Ethernet | 10/100/1000 MAC via CPM | — |
| Security Engine | SEC 2.0 (DES, 3DES, AES, SHA-1, MD-5) | — |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| RoHS Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance status] |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core | — | PowerPC e300c2 |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Operating Temperature Range | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Encryption / SEC Block | — | Not included (non-E variant) |