MPC8272CVRMIBA vs MPC8321CVRADDC Vergleich
Detaillierter Direktvergleich von MPC8272CVRMIBA von NXP Semiconductors und MPC8321CVRADDC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8272CVRMIBA - 266MHz PowerQUICC II MPU | NXP | SoC
MPC8272CVRMIBA ✗ AbgekündigtNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ AktivSpezifikationsvergleich
| Parameter | MPC8272CVRMIBA | MPC8321CVRADDC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $62,80 | $20,75 |
| Architecture | PowerPC G2_LE (32-bit) | — |
| Family | PowerQUICC II (MPC82xx) | — |
| Core Count | 1 | — |
| Core Clock Frequency | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Process Technology | 0.13 um | 90 nm CMOS |
| Versorgungsspannung | 3.3 V | 1.8 V / 2.5 V / 3.3 V |
| Betriebstemperatur | -40C to +105C | — |
| Gehäuse | 516-PBGA (27x27 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI 2.2, USB, UTOPIA, CPM, SEC 2.0, 2x UART, I2C, SPI | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Memory Interface | 32-bit DDR SDRAM with ECC | — |
| Ethernet | 10/100/1000 MAC via CPM | — |
| Security Engine | SEC 2.0 (DES, 3DES, AES, SHA-1, MD-5) | — |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance status] |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core | — | PowerPC e300c2 |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Betriebstemperaturbereich | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Encryption / SEC Block | — | Not included (non-E variant) |