MPC875VR133 vs MPC870VR66-FR Comparaison
Comparaison détaillée côte à côte de MPC875VR133 par NXP Semiconductors et MPC870VR66-FR par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC870VR66-FR - 66MHz PowerQUICC MPC8xx 32-bit CPU | Freescale/NXP
MPC870VR66-FR ObsoleteComparaison des spécifications
| Paramètre | MPC875VR133 | MPC870VR66-FR |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | Freescale Semiconductor (now NXP Semiconductors) |
| Series | PowerQUICC, MPC8xx | PowerQUICC I, MPC8xx |
| Core Architecture | Power Architecture (32-bit RISC) | Power Architecture, 32-bit |
| Core Count | 1 | 1 |
| Core Frequency | 133 MHz | 66 MHz |
| Performance | 176 MIPS | — |
| Largeur du bus de données | 32 bit | — |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Température de fonctionnement | 0 °C to +95 °C | 0 C to +95 C |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| I/O Supply Voltage | — | 3.3 V |
| Core Supply Voltage | — | 1.7 V to 1.9 V |
| Internal Cache | — | 16 KB |
| Boîtier | — | 256-PBGA (23x23 mm) |
| Packaging Option | — | Tape and Reel ('-FR' suffix) |
| Lead Free Status | — | Lead Free |
| Communications Processor Module (CPM) | — | Integrated, multi-channel serial controller |