MTFDKCC6T4TFS-1BC1ZABYY - 6.4TB U.3 NVMe Data Center SSD | Micron
Référence : MTFDKCC6T4TFS-1BC1ZABYY ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1450 | $1 450,00 |
| 10 | $1390 | $13 900,00 |
| 50 | $1310 | $65 500,00 |
| 100 | $1250 | $125 000,00 |
| 500 | $1180 | $590 000,00 |
MTFDKCC6T4TFS-1BC1ZABYY Présentation
A U.3 NVMe SSD is a small-form-factor enterprise storage device that combines the hot-plug 2.5-inch mechanical envelope of SAS/SATA SSDs with the high-bandwidth NVMe protocol, enabling up to ~7 GB/s sequential reads over PCIe Gen 4 x4. The 7450 MAX line sits at the top of Micron's 7450 stack for mixed-use endurance, below the PRO (read-intensive) and above entry NVMe data-center parts. As a data-center SSD it belongs to the hierarchy: NAND flash module -> NVMe SSD -> enterprise storage -> data-center infrastructure, and uses Micron's 176-layer replacement-gate TLC NAND paired with an in-house controller for predictable QoS under heavy random IO.
Key features include 6.4 TB raw TLC capacity, PCIe Gen 4 x4 NVMe interface, 176-layer NAND technology, and a 15 mm U.3 form factor (70 x 100 mm). The "MAX" classification indicates a higher drive-writes-per-day rating than PRO siblings, making this SKU appropriate for mixed read/write database and virtualization workloads rather than purely read-intensive archival use.
The drive leverages Micron's vertical 7450 architecture that combines a PCIe Gen 4 controller, DRAM cache, and 176-layer NAND into a single 15 mm U.3 module. The MAX endurance class targets sustained random write workloads in databases such as SQL Server, Oracle, MySQL, RocksDB, Cassandra, and Aerospike, where IOPS/Watt and predictable tail latency matter more than raw sequential bandwidth.
Typical applications include hyperscale data-center boot drives, mixed-use database acceleration (SQL, Oracle, NoSQL), virtualization and VDI storage tiers, software-defined storage nodes, AI/ML training data caches, and high-performance edge-compute servers. The U.3 form factor is drop-in compatible with U.2 backplanes that support NVMe Gen 4, simplifying fleet upgrades.
When designing with this drive, ensure the host backplane supports PCIe Gen 4 x4 and provides adequate airflow - sustained mixed-use workloads generate meaningful heat inside the 15 mm chassis. Drive firmware should be kept current via Micron's Storage Executive utility, and SMART attributes should be monitored for endurance (percentage used) in production fleets.
Alternatives de remplacement direct pour MTFDKCC6T4TFS-1BC1ZABYY — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MTFDKCC6T4TFS-1BC1ZABYY (même facteur de forme et même empreinte) — différant par Capacity, Encryption, Form Factor, Interface, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MTFDKCB6T4TFS-1BC1ZABYY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MTFDKCC7T6TFR-1BC1ZABYY
✅ Remplacement direct✓ En stock
$1099 / unité
Voir la fiche technique →MTFDKCC3T2TFR-1BC1ZABYY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MTFDKCC6T4TFR-1BC1ZAB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MTFDKCC6T4TFS-1BC1ZAB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MTFDKCC6T4TFS-1BC1ZABYY Spécifications
| Manufacturer | Micron Technology |
| Series | 7450 MAX |
| Capacity | 6.4 TB |
| NAND Technology | 176-layer TLC (Triple-Level Cell) |
| Interface | PCIe Gen 4 x4 NVMe |
| Form Factor | U.3 (15 mm), 70 x 100 mm |
| Endurance Class | Mixed Use (MAX) |
| Encryption | Non-SED (no hardware encryption) |
| Température de fonctionnement | 0C to +70C (data center) |
| Use Case | Data center mixed read/write workloads |
| Compatible Databases | SQL Server, Oracle, MySQL, RocksDB, Cassandra, Aerospike |
| Type de montage | Hot-plug 2.5-inch U.3 bay |
| Statut RoHS | Compliant |
| Statut du cycle de vie | Active |
| Target Market | Enterprise / data center |
Guide de configuration des broches du MTFDKCC6T4TFS-1BC1ZABYY data center mixed read/write workloads
Configuration des broches du MTFDKCC6T4TFS-1BC1ZABYY (boîtier data center mixed read/write workloads). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour MTFDKCC6T4TFS-1BC1ZABYY.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MTFDKCC6T4TFS-1BC1ZABYY convient pour 6 applications: Hyperscale Data Center Boot Drives, Mixed-Use Database Acceleration, Virtualization and VDI Storage Tier, Software-Defined Storage Nodes, AI/ML Training Data Cache, High-Performance Edge Compute Servers.
Hyperscale Data Center Boot Drives
The MTFDKCC6T4TFS-1BC1ZABYY suits hyperscale boot drive tiers because its 6.4 TB capacity supports modern OS images plus container runtimes while the U.3 15 mm form factor enables standard hot-swap bays. Its PCIe Gen 4 x4 NVMe interface delivers over 6 GB/s sequential reads per Micron's 7450 specifications, so thousands of servers can boot in parallel with minimal latency. The MAX mixed-use endurance rating tolerates frequent log writes from kernel and kubelet updates, and the 176-layer TLC NAND provides strong steady-state performance after the SLC cache fills under burst writes.
Recommandé
Mixed-Use Database Acceleration
For SQL Server, Oracle, and NoSQL databases such as Cassandra and Aerospike, the MTFDKCC6T4TFS-1BC1ZABYY's MAX endurance class delivers higher drive-writes-per-day tolerance than PRO read-intensive parts. The PCIe Gen 4 x4 NVMe interface sustains high IOPS on small-block random writes typical of write-ahead logs and B-tree page flushes, reducing transaction commit latency. The 6.4 TB capacity accommodates multi-terabyte indexes per drive, and the 176-layer TLC NAND provides consistent QoS once steady-state is reached, which is critical for predictable database p99 latency.
Recommandé
Virtualization and VDI Storage Tier
In VMware vSphere, Microsoft Hyper-V, and Citrix VDI deployments, the MTFDKCC6T4TFS-1BC1ZABYY's 6.4 TB capacity hosts dozens of VMs per drive while its mixed-use endurance handles random IO from many concurrent virtual desktops. PCIe Gen 4 x4 NVMe provides the IOPS-per-VM budget that legacy SATA SSDs cannot, reducing storage-induced login storms in VDI environments. Hot-plug U.3 15 mm bays simplify capacity expansion and field replacement in hyperconverged nodes such as Nutanix or VMware vSAN ReadyNodes.
Recommandé
Software-Defined Storage Nodes
Software-defined storage platforms like Ceph, MinIO, and vSAN benefit from the MTFDKCC6T4TFS-1BC1ZABYY because the 7450 MAX line provides consistent random write performance that erasure-coded replication depends on. Each 6.4 TB drive contributes to a failure domain, so the MAX endurance class extends service life across rebuild operations that hammer the surviving nodes. The U.3 15 mm form factor fits standard 2U and 4U storage servers with hot-swap cages, simplifying cluster scaling without chassis redesign.
Recommandé
AI/ML Training Data Cache
For AI/ML training pipelines, the MTFDKCC6T4TFS-1BC1ZABYY acts as a fast cache tier between network-attached object storage and GPU-local memory. Its PCIe Gen 4 x4 NVMe interface saturates GPU ingest bandwidth during dataset sharding, while the 6.4 TB capacity holds several large ImageNet or Common Crawl shards per drive. The 176-layer TLC NAND delivers steady sequential read throughput beyond 6 GB/s for shuffled data loading, minimizing GPU idle time during training epochs.
Recommandé
High-Performance Edge Compute Servers
Telco and industrial edge servers benefit from the MTFDKCC6T4TFS-1BC1ZABYY's U.3 15 mm form factor, which fits standard 1U-2U edge chassis with hot-swap bays. The MAX mixed-use endurance handles continuous local logging and analytics workloads at remote sites where drive replacement is expensive. PCIe Gen 4 x4 NVMe enables low-latency access for 5G MEC (multi-access edge compute) platforms processing IoT telemetry in real time, and the 6.4 TB capacity supports localized data retention before backhaul to central cloud.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MTFDKCC6T4TFS-1BC1ZABYY — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MTFDKCB6T4TFS-1BC1ZABYY | MTFDKCC7T6TFR-1BC1ZABYY | MTFDKCC3T2TFR-1BC1ZABYY | MTFDKCC6T4TFR-1BC1ZAB | MTFDKCC6T4TFS-1BC1ZAB |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | U.3 (15 mm), 70 x 100 mm | U.3 (7 mm) - same form factor family, thinner | U.3 (15 mm) - same | U.3 (15 mm) - same | U.3 (15 mm) - same | U.3 (15 mm) - same |
| Capacity | 6.4 TB | 6.4 TB | 7.68 TB (+20%) | 3.2 TB (-50%) | 6.4 TB | 6.4 TB |
| Series | 7450 MAX (Mixed Use) | 7450 MAX (Mixed Use) | 7450 MAX (Mixed Use) | 7450 MAX (Mixed Use) | 7450 MAX (Mixed Use) | 7450 MAX (Mixed Use) |
| Interface | PCIe Gen 4 x4 NVMe | PCIe Gen 4 x4 NVMe | PCIe Gen 4 x4 NVMe | PCIe Gen 4 x4 NVMe | PCIe Gen 4 x4 NVMe | PCIe Gen 4 x4 NVMe |
| NAND Technology | 176-layer TLC | 176-layer TLC | 176-layer TLC | 176-layer TLC | 176-layer TLC | 176-layer TLC |
| Encryption | Non-SED | Non-SED | Non-SED | Non-SED | Non-SED | Non-SED |
| Firmware Revision | B (MTFDKCC6T4TFS-1BC1ZABYY) | B | B | B | A | A |
Principaux différenciateurs
- Highest-capacity MAX mixed-use SKU in standard 15 mm U.3 height for drop-in boot-tier replacement (vs MTFDKCB6T4TFS-1BC1ZABYY)
- B firmware revision with latest Micron stability fixes (vs MTFDKCC6T4TFS-1BC1ZAB)
- Optimal capacity-density sweet spot for hyperscale (vs MTFDKCC7T6TFR-1BC1ZABYY)
Notes de conception
The MTFDKCC6T4TFS-1BC1ZABYY is rated for 0C to +70C operating ambient per Micron's 7450 datasheet. Sustained mixed-use workloads at 6.4 TB capacity draw more power than read-intensive SKUs; in dense 1U sleds, verify inlet temperatures stay under 35C to keep SMART temperature attributes below 60C, and ensure front-to-back airflow follows Micron's 7450 thermal characterization guidance.
Estimated: confirm the host backplane supports PCIe Gen 4 x4 before deployment - the MTFDKCC6T4TFS-1BC1ZABYY will negotiate down to Gen 3 on Gen 3 backplanes but loses approximately 50% of peak sequential throughput. Verify that the chassis accepts the 15 mm U.3 height; thinner 7 mm bays will not seat this drive and the SKU will not physically fit. Non-SED means no hardware encryption - if your security policy mandates at-rest encryption, choose a Micron 7450 SED variant instead.
U.3 (SFF-TA-1001) edge connector provides PCIe Gen 4 x4 plus sideband management; ensure the system board implements the SMBus/NC-SI management paths Micron expects for out-of-band telemetry. For U.2 backplanes the MTFDKCC6T4TFS-1BC1ZABYY is functionally compatible but verify pinout conformance because some legacy U.2 implementations lacked the dual-port SAS pins that U.3 repurposes for dual-port NVMe.
PCIe Gen 4 signaling at 16 GT/s requires careful host retimer placement for longer traces. Estimated: when designing a custom carrier, budget at least 1 dB of insertion-loss margin to the MTFDKCC6T4TFS-1BC1ZABYY's receiver, and reference Micron's 7450 platform design guide for the recommended PCIe redriver or retimer topology. Cabling through a backplane should use SFF-TA-1001 certified cables rated for Gen 4.
Informations de conformité
RoHS and lead-free compliance confirmed by Micron's 7450 product page. AEC-Q100 not applicable for data-center SSDs (qualification standard for automotive-grade ICs, not NAND modules). Halogen-free status not explicitly stated in verified web data.
