MW7IC2040NR1 vs MW7IC18100NR1 Comparaison
Comparaison détaillée côte à côte de MW7IC2040NR1 par NXP Semiconductors et MW7IC18100NR1 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MW7IC2040NR1 | MW7IC18100NR1 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | RF Amplifiers | RF Amplifiers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $24,20 | $61,20 |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola Semiconductor) | — |
| Technology | RF LDMOS (Laterally Diffused MOSFET) | — |
| RF Type | General Purpose / Wideband Integrated Power Amplifier | — |
| Fonction | Two-stage integrated power amplifier with on-chip matching | — |
| Frequency Range (Application) | 1805 MHz to 1990 MHz (covers 1805-1880 MHz DCS/PCS and 1930-1990 MHz UMTS) | — |
| Frequency Range (Characterization) | 100 MHz to 1 GHz | — |
| Supply Voltage (Vdd) | 24 V to 32 V (nominal 28 V) | — |
| Maximum Supply Voltage | 32 V | — |
| Quiescent Supply Current (Idq) | 75 mA | — |
| Small-Signal Gain | 23.5 dB | — |
| Output Power (avg, W-CDMA) | 4 W (typical at rated operating conditions) | — |
| Modulation Compatibility | Single W-CDMA, GSM/EDGE, UMTS, LTE, all typical cellular BTS formats | — |
| Boîtier / Format | TO-270 WBL-16 (TO-270-16 Variant, Flat Leads), plastic over-mold surface-mount | TO-270 WB-14 (Case 1618-02), plastic, flat leads |
| Nombre de broches | 16 | — |
| Operating Mode | Class-AB (multi-stage, externally biased) | — |
| Lead Configuration | Flat leads (surface-mount) | — |
| Type de montage | Surface Mount (PCB solderable with bottom drain ground plane) | Surface Mount (gull-wing flat leads) |
| Température de fonctionnement | -40 C to +85 C (industrial base-station operating ambient; per Freescale/NXP LDMOS module family) | -40C to +85C (case) |
| Packaging Type | Tape & Reel (per part suffix NR1 suffix convention) | — |
| Statut RoHS | Compliant (per NXP product family) | Compliant |
| Product Type | — | RF LDMOS Wideband Integrated Power Amplifier |
| Frequency Range | — | 1.805 GHz to 2.05 GHz |
| Output Power (CW, typical) | — | 100 W (50 dBm) |
| Power Gain (typical) | — | 30 dB |
| P1dB (typical) | — | 25 W (44 dBm) CW |
| Supply Voltage (VDD) | — | 24 V to 32 V (28 V typical) |
| Supply Current (typical) | — | 1.18 A |
| RF Modulation Support | — | GSM, GSM EDGE, CDMA, W-CDMA |
| VSWR Ruggedness | — | 5:1 stable into mismatch |
| Spurious (100 mW to 5 W CW) | — | Below -60 dBc |
| Lead Finish | — | e3 (matte tin) |
| Body Material | — | Plastic / Epoxy |