S912XEQ512J3CAGR vs MC9S12XDT512MAA Comparaison
Comparaison détaillée côte à côte de S912XEQ512J3CAGR par NXP Semiconductors et MC9S12XDT512MAA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | S912XEQ512J3CAGR | MC9S12XDT512MAA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $17,80 | $0,00 |
| Core Architecture | HCS12X (16-bit) | — |
| CPU Family | S12XE | — |
| Core Frequency | 50 MHz | — |
| Program Memory (Flash) | 512 KB (512K x 8) | — |
| RAM | 32 KB | — |
| EEPROM | 4 KB | — |
| Operating Voltage | [DATA_NEEDED: Vdd range] | — |
| Plage de température de fonctionnement | -40 C to +85 C (industrial) | — |
| Boîtier | 144-LQFP (20 mm x 20 mm) | 80-QFP (14x14 mm), Square, Gull Wing |
| Type de montage | Surface Mount | Surface Mount |
| I/O Pins | [DATA_NEEDED: count] | — |
| CAN Controllers | 4 x CAN 2.0A/B (msCAN) | — |
| SCI / UART | 2 | — |
| SPI | 1 | — |
| I2C | 1 | — |
| ADC | 8-channel, 10-bit | — |
| PWM Channels | [DATA_NEEDED: count] | — |
| Co-Processor | XGATE (RISC, up to 100 MHz) | — |
| Statut RoHS | Compliant | — |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Tension d'alimentation | — | [DATA_NEEDED: supply voltage range] |
| Température de fonctionnement | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Sans halogène | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |