SC667112CLC vs MC9S08QD4CSC Comparaison
Comparaison détaillée côte à côte de SC667112CLC par NXP Semiconductors et MC9S08QD4CSC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | SC667112CLC | MC9S08QD4CSC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2,92 | $0,00 |
| Core Architecture | S08 (8-bit CISC) | — |
| Core Family | Freescale/NXP S08 family | — |
| Maximum CPU Frequency | 20 MHz | — |
| Program Memory (Flash) | 16 KB | — |
| Instruction Set Compatibility | Freescale HC08 (upward compatible) | — |
| Bus Architecture | Von Neumann | — |
| Maximum Operating Frequency | 20 MHz | — |
| Operating Voltage Range | [DATA_NEEDED: Vdd range] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: industrial/commercial grade] | — |
| Package Type | LQFP | — |
| Type de montage | Surface Mount | Surface Mount |
| Nombre de broches | [DATA_NEEDED: pin count from LQFP package] | — |
| On-chip Debug | Background Debug Mode (BDM) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | — |
| Manufacturing Status | Rochester Electronics continues supply as authorized aftermarket source | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Fréquence d'horloge maximale | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Tension d'alimentation | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Boîtier | — | 8-SOIC |
| Packaging | — | Tube |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | — | End of Life (per NXP product page) |