XC6SLX45-2FG484I vs XC6SLX45-2FG484C Comparaison
Comparaison détaillée côte à côte de XC6SLX45-2FG484I par Xilinx et XC6SLX45-2FG484C par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC6SLX45-2FG484I | XC6SLX45-2FG484C |
|---|---|---|
| Marque | Xilinx | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Unknown | Actif |
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 43,661 cells | — |
| Number of I/O | 316 I/O | — |
| Listed Internal Frequency | 500 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Operating Voltage | 1.2 V | — |
| Device Family | Spartan-6 LX | — |
| Speed Grade | -2 | -2 |
| Temperature Grade | Industrial | Commercial (C) |
| Plage de température de fonctionnement | -40°C to +100°C (junction temperature) | — |
| Boîtier | 484-BBGA | 484-pin FBGA, 15 x 15 mm, 0.80 mm pitch |
| Type de montage | Surface mount | — |
| Package Pitch | 0.80 mm | — |
| Package Lead-Free Status | Lead free | — |
| Number of Logic Cells in Alternative Comparison | 43,661 cells | — |
| Adaptive Logic Modules | [DATA_NEEDED: Adaptive Logic Module count] | 6,822 ALM |
| Embedded Memory | [DATA_NEEDED: Embedded block RAM capacity] | 2.04 Mbit |
| DSP Resources | [DATA_NEEDED: DSP slice count] | — |
| Configuration Memory | [DATA_NEEDED: Configuration memory type and capacity] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Status | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Logic Elements | — | 43,661 LE |
| Internal Frequency | — | 500 MHz |
| I/O Sites | — | 316 I/O |
| Package Pins | — | 484 pins |
| Core Supply Voltage | — | 1.2 V |
| Température de fonctionnement | — | 0°C to 85°C |
| Logic Architecture | — | Adaptive Logic Module (ALM) FPGA |
| Programming Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Fréquence d'horloge maximale | — | [DATA_NEEDED: maximum user clock frequency] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Lead-Free Termination | — | Lead-free package |
| Package Dimensions | — | 15 x 15 mm |
| Ball Pitch | — | 0.80 mm |