XC6SLX45-2FG484I vs XC6SLX45-2FG484C 비교
다음의 상세 나란히 비교: XC6SLX45-2FG484I 제조: Xilinx 및 XC6SLX45-2FG484C 제조: AMD. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | XC6SLX45-2FG484I | XC6SLX45-2FG484C |
|---|---|---|
| 브랜드 | Xilinx | AMD |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Unknown | 활성 |
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 43,661 cells | — |
| Number of I/O | 316 I/O | — |
| Listed Internal Frequency | 500 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Operating Voltage | 1.2 V | — |
| Device Family | Spartan-6 LX | — |
| Speed Grade | -2 | -2 |
| Temperature Grade | Industrial | Commercial (C) |
| 동작 온도 범위 | -40°C to +100°C (junction temperature) | — |
| 패키지 | 484-BBGA | 484-pin FBGA, 15 x 15 mm, 0.80 mm pitch |
| 실장 유형 | Surface mount | — |
| Package Pitch | 0.80 mm | — |
| Package Lead-Free Status | Lead free | — |
| Number of Logic Cells in Alternative Comparison | 43,661 cells | — |
| Adaptive Logic Modules | [DATA_NEEDED: Adaptive Logic Module count] | 6,822 ALM |
| Embedded Memory | [DATA_NEEDED: Embedded block RAM capacity] | 2.04 Mbit |
| DSP Resources | [DATA_NEEDED: DSP slice count] | — |
| Configuration Memory | [DATA_NEEDED: Configuration memory type and capacity] | — |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Status | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Logic Elements | — | 43,661 LE |
| Internal Frequency | — | 500 MHz |
| I/O Sites | — | 316 I/O |
| Package Pins | — | 484 pins |
| Core Supply Voltage | — | 1.2 V |
| 동작 온도 | — | 0°C to 85°C |
| Logic Architecture | — | Adaptive Logic Module (ALM) FPGA |
| Programming Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| 최대 클록 주파수 | — | [DATA_NEEDED: maximum user clock frequency] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Lead-Free Termination | — | Lead-free package |
| Package Dimensions | — | 15 x 15 mm |
| Ball Pitch | — | 0.80 mm |