XC6SLX75-3FGG676C vs XC6SLX75-3FG676C Comparaison
Comparaison détaillée côte à côte de XC6SLX75-3FGG676C par Xilinx et XC6SLX75-3FG676C par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Xilinx
XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx
XC6SLX75-3FGG676C ✓ ActifComparaison des spécifications
| Paramètre | XC6SLX75-3FGG676C | XC6SLX75-3FG676C |
|---|---|---|
| Marque | Xilinx | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 74,637 | 74,637 cells |
| Configurable Logic Blocks (CLBs) | 5,831 | — |
| User I/O | 408 | — |
| DSP48A1 Slices | 132 | — |
| Block RAM | 3,096 Kbit | [DATA_NEEDED: block RAM resources] |
| Internal Frequency | 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) | 667 MHz |
| Tension d'alimentation | 1.14 V to 1.26 V | [DATA_NEEDED: supply voltage] |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Speed Grade | -3 (highest performance grade) | -3 |
| Température de fonctionnement | 0 C to 85 C (commercial) | 0°C to 85°C (32°F to 185°F) |
| Package Type | FBGA-676 (PBGA676) | 676-BGA |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm ball pitch | 27 mm × 27 mm |
| Type de montage | Surface Mount | Surface mount |
| Clock Management | DCM and PLL present | — |
| Lead-Free | Yes | — |
| RoHS | [DATA_NEEDED: RoHS compliance statement for this exact orderable] | — |
| REACH | [DATA_NEEDED: REACH declaration for this exact orderable] | — |
| Automotive Grade (AEC-Q100) | Not qualified - commercial temperature grade | — |
| Maximum Package Pin Count | 676 balls | — |
| Device Family | — | Spartan-6 LX |
| Configurable Logic Blocks | — | 5,831 CLBs |
| Package Description | — | FBGA-676 |
| Ball Pitch | — | 1.0 mm |
| Terminal Count | — | 676 terminals |
| Package Family | — | FBGA |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| DSP Resources | — | [DATA_NEEDED: DSP resources] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| Statut RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |