XC6SLX75-3FGG676C vs XC6SLX75-3FG676C 比較

詳細な並列比較: XC6SLX75-3FGG676C メーカー: Xilinx および XC6SLX75-3FG676C メーカー: AMD。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

AMD
XC6SLX75-3FG676C XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C ✓ 生産中

仕様比較

パラメータ XC6SLX75-3FGG676C XC6SLX75-3FG676C
ブランド Xilinx AMD
カテゴリ FPGA & CPLD FPGA & CPLD
ライフサイクル状態 有効 有効
Device Type FPGA (Field Programmable Gate Array) FPGA
FPGA Family Spartan-6 LX —
Logic Cells 74,637 74,637 cells
Configurable Logic Blocks (CLBs) 5,831 —
User I/O 408 —
DSP48A1 Slices 132 —
Block RAM 3,096 Kbit [DATA_NEEDED: block RAM resources]
Internal Frequency 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) 667 MHz
電源電圧 1.14 V to 1.26 V [DATA_NEEDED: supply voltage]
Process Technology 45 nm CMOS 45 nm CMOS
Speed Grade -3 (highest performance grade) -3
動作温度 0 C to 85 C (commercial) 0°C to 85°C (32°F to 185°F)
Package Type FBGA-676 (PBGA676) 676-BGA
Package Dimensions 27 mm x 27 mm, 1.0 mm ball pitch 27 mm × 27 mm
実装タイプ Surface Mount Surface mount
Clock Management DCM and PLL present —
Lead-Free Yes —
RoHS [DATA_NEEDED: RoHS compliance statement for this exact orderable] —
REACH [DATA_NEEDED: REACH declaration for this exact orderable] —
Automotive Grade (AEC-Q100) Not qualified - commercial temperature grade —
Maximum Package Pin Count 676 balls —
Device Family — Spartan-6 LX
Configurable Logic Blocks — 5,831 CLBs
Package Description — FBGA-676
Ball Pitch — 1.0 mm
Terminal Count — 676 terminals
Package Family — FBGA
I/O Standard — [DATA_NEEDED: supported I/O standards]
DSP Resources — [DATA_NEEDED: DSP resources]
Configuration Method — [DATA_NEEDED: configuration method]
RoHS ステータス — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
Lead-Free Status — [DATA_NEEDED: lead-free status]

データシート&リソース

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