XC6SLX75-3FGG676C vs XC6SLX75-3FG676C 对比

详细并排对比 XC6SLX75-3FGG676C 出自 Xilinx 和 XC6SLX75-3FG676C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

AMD
XC6SLX75-3FG676C XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C ✓ 量产中

规格对比

参数 XC6SLX75-3FGG676C XC6SLX75-3FG676C
品牌 Xilinx AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type FPGA (Field Programmable Gate Array) FPGA
FPGA Family Spartan-6 LX —
Logic Cells 74,637 74,637 cells
Configurable Logic Blocks (CLBs) 5,831 —
User I/O 408 —
DSP48A1 Slices 132 —
Block RAM 3,096 Kbit [DATA_NEEDED: block RAM resources]
Internal Frequency 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) 667 MHz
电源电压 1.14 V to 1.26 V [DATA_NEEDED: supply voltage]
Process Technology 45 nm CMOS 45 nm CMOS
Speed Grade -3 (highest performance grade) -3
工作温度 0 C to 85 C (commercial) 0°C to 85°C (32°F to 185°F)
Package Type FBGA-676 (PBGA676) 676-BGA
Package Dimensions 27 mm x 27 mm, 1.0 mm ball pitch 27 mm × 27 mm
安装类型 Surface Mount Surface mount
Clock Management DCM and PLL present —
Lead-Free Yes —
RoHS [DATA_NEEDED: RoHS compliance statement for this exact orderable] —
REACH [DATA_NEEDED: REACH declaration for this exact orderable] —
Automotive Grade (AEC-Q100) Not qualified - commercial temperature grade —
Maximum Package Pin Count 676 balls —
Device Family — Spartan-6 LX
Configurable Logic Blocks — 5,831 CLBs
Package Description — FBGA-676
Ball Pitch — 1.0 mm
Terminal Count — 676 terminals
Package Family — FBGA
I/O Standard — [DATA_NEEDED: supported I/O standards]
DSP Resources — [DATA_NEEDED: DSP resources]
Configuration Method — [DATA_NEEDED: configuration method]
RoHS 状态 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
Lead-Free Status — [DATA_NEEDED: lead-free status]

数据手册与资源

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