XC7Z100-1FF900I vs XC7Z100-2FF900I Comparaison

Comparaison détaillée côte à côte de XC7Z100-1FF900I par AMD et XC7Z100-2FF900I par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

AMD
XC7Z100-1FF900I XC7Z100-1FF900I - Dual Cortex-A9 Zynq SoC | AMD

XC7Z100-1FF900I - Dual Cortex-A9 Zynq SoC | AMD

XC7Z100-1FF900I ✓ Actif

Comparaison des spécifications

Paramètre XC7Z100-1FF900I XC7Z100-2FF900I
Marque AMD AMD
Catégorie FPGA & CPLD FPGA & CPLD
Statut du cycle de vie Actif Actif
Product Type Zynq-7000 system on chip —
Processor Configuration Dual Arm Cortex-A9 MPCore —
Processor Operating Frequency 667 MHz —
FPGA Logic Cells 444K logic cells 444K logic cells
FPGA Architecture Kintex-7 —
Debug and Trace CoreSight —
Package Type 900-FCBGA —
Package Dimensions 31 x 31 mm —
Package Ball Count 900 balls —
Device Family Zynq-7000 —
Architecture Dual-core ARM Cortex-A9 with Kintex-7 programmable logic —
Plage de température de fonctionnement [DATA_NEEDED: operating temperature range] [DATA_NEEDED: minimum and maximum operating temperature]
Supply Voltage Range [DATA_NEEDED: supply voltage range] —
Maximum I/O Count [DATA_NEEDED: maximum I/O count] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Statut RoHS RoHS [DATA_NEEDED: RoHS compliance declaration]
Type de montage Surface mount Surface mount
Manufacturer Qualification [DATA_NEEDED: industrial or automotive qualification] —
Device Type — Zynq-7000 Kintex-7 programmable system-on-chip
Processor Subsystem — Dual ARM Cortex-A9 MPCore
Processor Clock Rating — 800 MHz
FPGA Family — Kintex-7
Boîtier — 900-FCBGA, 31 mm x 31 mm
Package Pin Count — 900 pins
Device Speed Grade — -2
Temperature Grade — Industrial
Integrated Programmable Logic — 444K Kintex-7 logic cells
Debug Support — ARM CoreSight debug resources
Design Toolchain — AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version]
Number of High-Speed Transceivers — [DATA_NEEDED: transceiver count]
Maximum Transceiver Data Rate — [DATA_NEEDED: maximum transceiver data rate]
Programmable I/O Count — [DATA_NEEDED: programmable I/O count]
Memory Interface Details — [DATA_NEEDED: memory interface types and supported rates]
Power Supply Inputs — [DATA_NEEDED: supply rail names and voltage ranges]
Typical Power Consumption — [DATA_NEEDED: typical and maximum power consumption]
REACH Status — [DATA_NEEDED: REACH compliance declaration]
Lead-Free Status — [DATA_NEEDED: lead-free packaging declaration]
AEC-Q100 Qualification — Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component
Package Thermal Resistance — [DATA_NEEDED: package thermal resistance]

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