XC7Z100-1FF900I vs XC7Z100-2FF900I 비교
다음의 상세 나란히 비교: XC7Z100-1FF900I 제조: AMD 및 XC7Z100-2FF900I 제조: AMD. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | XC7Z100-1FF900I | XC7Z100-2FF900I |
|---|---|---|
| 브랜드 | AMD | AMD |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| Product Type | Zynq-7000 system on chip | — |
| Processor Configuration | Dual Arm Cortex-A9 MPCore | — |
| Processor Operating Frequency | 667 MHz | — |
| FPGA Logic Cells | 444K logic cells | 444K logic cells |
| FPGA Architecture | Kintex-7 | — |
| Debug and Trace | CoreSight | — |
| Package Type | 900-FCBGA | — |
| Package Dimensions | 31 x 31 mm | — |
| Package Ball Count | 900 balls | — |
| Device Family | Zynq-7000 | — |
| Architecture | Dual-core ARM Cortex-A9 with Kintex-7 programmable logic | — |
| 동작 온도 범위 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: minimum and maximum operating temperature] |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| Maximum I/O Count | [DATA_NEEDED: maximum I/O count] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| RoHS 상태 | RoHS | [DATA_NEEDED: RoHS compliance declaration] |
| 실장 유형 | Surface mount | Surface mount |
| Manufacturer Qualification | [DATA_NEEDED: industrial or automotive qualification] | — |
| Device Type | — | Zynq-7000 Kintex-7 programmable system-on-chip |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore |
| Processor Clock Rating | — | 800 MHz |
| FPGA Family | — | Kintex-7 |
| 패키지 | — | 900-FCBGA, 31 mm x 31 mm |
| Package Pin Count | — | 900 pins |
| Device Speed Grade | — | -2 |
| Temperature Grade | — | Industrial |
| Integrated Programmable Logic | — | 444K Kintex-7 logic cells |
| Debug Support | — | ARM CoreSight debug resources |
| Design Toolchain | — | AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version] |
| Number of High-Speed Transceivers | — | [DATA_NEEDED: transceiver count] |
| Maximum Transceiver Data Rate | — | [DATA_NEEDED: maximum transceiver data rate] |
| Programmable I/O Count | — | [DATA_NEEDED: programmable I/O count] |
| Memory Interface Details | — | [DATA_NEEDED: memory interface types and supported rates] |
| Power Supply Inputs | — | [DATA_NEEDED: supply rail names and voltage ranges] |
| Typical Power Consumption | — | [DATA_NEEDED: typical and maximum power consumption] |
| REACH Status | — | [DATA_NEEDED: REACH compliance declaration] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free packaging declaration] |
| AEC-Q100 Qualification | — | Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component |
| Package Thermal Resistance | — | [DATA_NEEDED: package thermal resistance] |