XC7Z100-2FFG900I vs XC7Z100-2FF900I Comparaison
Comparaison détaillée côte à côte de XC7Z100-2FFG900I par AMD et XC7Z100-2FF900I par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
AMD
XC7Z100-2FFG900I - Zynq-7000 SoC, Kintex-7 FPGA, 444K Logic Cells | AMD
XC7Z100-2FFG900I ✓ ActifComparaison des spécifications
| Paramètre | XC7Z100-2FFG900I | XC7Z100-2FF900I |
|---|---|---|
| Marque | AMD | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Device Family | Zynq-7000 All Programmable SoC | — |
| Architecture | ARM Cortex-A9 dual-core MPCore + Kintex-7 FPGA | — |
| Logic Cells (PL) | 444K | — |
| Block RAM | 26.5 Mb | — |
| DSP Slices | 1540 (DSP48E1) | — |
| Processor Cores | 2x ARM Cortex-A9 MPCore with CoreSight | — |
| Max Processor Frequency | 800 MHz (up to 1 GHz with -3 speed grade) | — |
| Transceivers | 16x GTX up to 6.25 Gb/s | — |
| PCIe Hard Blocks | 4x Gen2 (Root Complex or Endpoint) | — |
| Memory Interfaces | DDR3, DDR3L, DDR2, LPDDR2 (16-bit and 32-bit; ECC on PS side) | — |
| Ethernet MACs | 2x 10/100/1000 Mbps GEM | — |
| USB | 2x USB 2.0 OTG | — |
| Security | AES, SHA-256, RSA, secure boot, JTAG disable | — |
| ADC | Dual 12-bit 1 MSPS XADC | — |
| Température de fonctionnement | -40C to +100C (Industrial) | — |
| Boîtier | 900-ball FCBGA (FFG) 31x31 mm | 900-FCBGA, 31 mm x 31 mm |
| Speed Grade | -2 (mid-performance) | — |
| Temperature Grade | I (Industrial) | Industrial |
| Device Type | — | Zynq-7000 Kintex-7 programmable system-on-chip |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore |
| Processor Clock Rating | — | 800 MHz |
| FPGA Logic Cells | — | 444K logic cells |
| FPGA Family | — | Kintex-7 |
| Package Pin Count | — | 900 pins |
| Device Speed Grade | — | -2 |
| Type de montage | — | Surface mount |
| Integrated Programmable Logic | — | 444K Kintex-7 logic cells |
| Debug Support | — | ARM CoreSight debug resources |
| Design Toolchain | — | AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version] |
| Plage de température de fonctionnement | — | [DATA_NEEDED: minimum and maximum operating temperature] |
| Number of High-Speed Transceivers | — | [DATA_NEEDED: transceiver count] |
| Maximum Transceiver Data Rate | — | [DATA_NEEDED: maximum transceiver data rate] |
| Programmable I/O Count | — | [DATA_NEEDED: programmable I/O count] |
| Memory Interface Details | — | [DATA_NEEDED: memory interface types and supported rates] |
| Power Supply Inputs | — | [DATA_NEEDED: supply rail names and voltage ranges] |
| Typical Power Consumption | — | [DATA_NEEDED: typical and maximum power consumption] |
| Statut RoHS | — | [DATA_NEEDED: RoHS compliance declaration] |
| REACH Status | — | [DATA_NEEDED: REACH compliance declaration] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free packaging declaration] |
| AEC-Q100 Qualification | — | Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component |
| Package Thermal Resistance | — | [DATA_NEEDED: package thermal resistance] |